High-speed imaging accelerates solder checks: News from Agilent Technologies Europe

Note: A free brochure or catalogue is available from Agilent Technologies Europe on the products in this news release. Click here to request a copy.

Agilent Technologies has introduced a new solder paste inspection system claimed to enable manufacturers of printed circuit board assemblies to slash inspection time in half, without compromising capability. The system brings industry-leading accuracy and repeatability that has been verified by early adopters, including manufacturers working with 01005 components. Patented imaging techniques coupled with powerful inspection algorithms puts this system far ahead of the competition.

The Agilent Medalist SP50 Series 3 is poised to help manufacturers define the path for solder paste inspection going forward.

It demonstrates enhanced ease of use and throughput, as well as accuracy and repeatability, all critical factors that help save time and money.

As technology trends and production costs pose new challenges to the industry, it is becoming increasingly important for manufacturers to implement an industry-friendly solder paste inspection system that can provide process feedback and control to help them not only catch defects early, but prevent them from happening in the first place.

'We are committed to help manufacturers meet their latest challenges and needs, and the SP50 Series 3 has the technological capabilities to do that', said Bernadette Duffy, Agilent's Marketing Manager for Automated Optical Inspection.

'Be it a three-month plan to tackle manufacturing needs, or a three-year product roadmap to help our customers grow their inspection capabilities, our dynamic team of experts are geared to help manufacturers keep ahead', she said.

Agilent will demonstrate the new Medalist SP50 Series 3 system on Booth 2213 at Apex 2007, from 20th to 22nd February, at the Los Angeles Convention Centre, California.

The Agilent Medalist SP50 Series 3 is available now. Request a free brochure from Agilent Technologies Europe....

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High-speed imaging accelerates solder checks

Solder paste inspection system is claimed to enable manufacturers of printed circuit board assemblies to slash inspection time in half, without compromising capability.