Product category: Electronics Manufacturing Materials and Consumables
News Release from: Agere Systems | Subject: Lead-free packaging
Edited by the Electronicstalk Editorial Team on 23 September 2004
Nickel layer stops packages sprouting
tin whiskers
Agere Systems reckons its engineers have found the right mix of packaging ingredients to enable the semiconductor industry to successfully implement lead-free packaging.
Agere Systems reckons its engineers have found the right mix of packaging ingredients to enable the semiconductor industry to successfully implement lead-free packaging The company's formula eliminates lead from the packaging process and avoids a potentially devastating flaw in bringing to market lead-free packages
This article was originally published on Electronicstalk on 8 Mar 2007 at 8.00am (UK)
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Agere's new semiconductor packaging recipe aims to increase reliability and performance of chips while eliminating lead - a hazardous material widely used in chips today.
Lead-free semiconductor packaging will be mandatory in the European Union in just over a year, but will be implemented globally in nearly every semiconductor package produced - impacting the trillions of microchips produced worldwide every year by the $166 billion semiconductor industry.
Every company manufacturing or using chips in electronic products is working on finding the right combination of materials to allow its products to be sold throughout Europe and in other countries adopting similar legislation.