Product category: Electronics Manufacturing Materials and Consumables
News Release from: Indium Corporation of America
Edited by the Electronicstalk Editorial Team on 8 November 2004
Power semiconductor materials
focus of trade show
At the 37th International Symposium on Microelectronics November 16-18, 2004, Indiumıs exhibit will focus on Power Semiconductor Materials, such as Solder Wire, Solder Preforms and Solder Paste
Indium Corporation of America will be exhibiting at the 37th International Symposium on Microelectronics IMAPS trade show in Long Beach, CA on November 16-18, 2004, Indium's exhibit will focus on Power Semiconductor Materials, such as Solder Wire, solder preforms and Solder Paste, and Packaging Materials, such as Flip-Chip Fluxes, Die-Attach Materials, and Gold-Tin Capabilities.
This article was originally published on Electronicstalk on 8 November 2004 at 8.00am (UK)
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In addition, Indium will feature Thermal Interface Materials.
Indium Corporation will be located at booth #649.
Indium Corporation is a three-time Frost and Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-free solder alloys, underfill materials, die-attach materials, and more.
The company is also the world's premiere supplier of commercial grade and high-purity indium.
Factories are located in North America, Europe, and Asia.
Founded in 1934, the company is ISO 9001 registered.
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