Product category: Electronics Manufacturing Machinery and Materials
News Release from: Indium Corporation of America
Edited by the Electronicstalk Editorial Team on 16 September 2004
Lee to tell all on lead-free soldering
Dr Ning-Cheng Lee will present a workshop entitled "Lead-free soldering - metallurgical fundamentals, reflow application and challenges", at the CEMCEX Conference
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Dr Ning-Cheng Lee will lecture on metallurgical fundamentals and optimal processes at the International Conference on Soldering and Reliability in Toronto
Indium Corporation of America's Vice President of Technology, Dr Ning-Cheng Lee, will present a workshop entitled "Lead-free soldering - metallurgical fundamentals, reflow application and challenges", at the CEMCEX Conference in the Czech Republic on 12th October and in Hungary on 14th October.
Dr Lee is a world-renown soldering expert and also has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills and adhesives.
His current research interests cover advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership.
The workshop is designed to provide an understanding of the fundamental design considerations of lead-free alloys, with emphasis on metallurgical properties analysis.
The performance of representative alloys on reflow soldering will be presented and compared in order to illustrate the processing potentials of those alternatives.
Major challenges encountered will also be discussed, with the focus on metallurgical causes.
In addition to the workshop, Dr Lee will present a short programme titled "The effect of lead-free alloy composition on tombstoning".
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