News Release from: Indium Corporation of America
Edited by the Electronicstalk Editorial Team on 23 November 2006
Mackie manages semiconductor packaging materials
Indium Corporation has announced the addition of Andy Mackie as Product Manager for Semiconductor Packaging Materials.
Note: Readers of the Editor’s free email newsletter will have read this news when it was announced. . It’s free!
Indium Corporation has announced the addition of Andy Mackie as Product Manager for Semiconductor Packaging Materials. Mackie is based at Indium's Global Headquarters in Clinton, New York, and reports to the Director of Solder Products. Mackie is responsible for the global marketing efforts for all of Indium's Semiconductor Packaging Materials, including solder spheres, ball attach fluxes, wafer bumping fluxes and pastes, and epoxy fluxes.
Mackie has over 17 years of experience in new product development, sales, and marketing of electronics assembly and semiconductor packaging.
He is an industry expert in solder paste printing, reflow, and atmosphere control in electronics assembly.
He received the IPC President's Award in 2001 for his leadership in IPC's Solder Paste Task Force and the Assembly and Joining Materials Subcommittee.
Mackie has a PhD in physical chemistry from the University of Nottingham, UK, and a Masters of Science in Surface and Colloid Chemistry from the University of Bristol, UK.
He is trained in Six Sigma 'Design of experiments' and has written numerous papers which have been published globally.
• Indium Corporation of America: contact details and other news
• Other news in Manufacturing Machinery and Materials
• Email this news to a colleague
•
• RSS news feed for Indium Corporation of America
• RSS news feed for Manufacturing Machinery and Materials
• Electronicstalk Home Page
Site copyright © 2000-2006 Pro-Talk Ltd, UK. Based on information from Indium Corporation of America
Click on the advertisement to visit the advertiser's web site now