Product category: Electronics Manufacturing Materials and Consumables
News Release from: Sabic Innovative Plastics | Subject: LNP Starflam UF-1006 HW Z270
Edited by the Electronicstalk Editorial Team on 19 October 2006
Speciality compound withstands lead-free
reflow
When Winchester Electronics began developing a complete line of RoHS-compliant products it found the plastics it had traditionally used could not handle lead-free reflow.
Lead and other heavy metals have been shown to accumulate in the environment The European Union's (EU) Restriction of Hazardous Substances (RoHS) Directive limits the use of these materials in electrical/electronic (E/E) components and products
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
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The RoHS regulations have led to industry adoption of a soldering process that meets lead-free requirements for surface mounting of connectors onto printed circuit boards.
As a result, Winchester Electronics, a manufacturer of high-speed, high-bandwidth interconnect solutions, began developing a complete line of RoHS-compliant products.
But the company found the polybutylene terephthalate (PBT) resin, which it was using could not withstand the higher temperatures generated by infra-red (IR) reflow ovens used in lead-free soldering.
Further reading
Compounds handle lead-free thermal stress
A range of new grades of high-heat connector materials have been specially designed to resist the thermal challenges of infra-red reflow soldering.