Click on the advert above to visit the company web site
Product category: Electronics Manufacturing Materials and Consumables
News Release from: IRC Advanced Film Division | Subject: TFC copper substrate
Edited by the Electronicstalk Editorial Team on 30 August 2007
Copper substrate handles high-current
use
Request your FREE weekly copy of the Electronicstalk email newsletter. News about Electronics Manufacturing Materials and Consumables and more every issue. Click here for details.
TT electronics IRC Advanced Film Division's cost-effective, solderable thick film copper substrate is now being specified for high-current and power module applications.
TT electronics IRC Advanced Film Division's solderable thick film copper substrate is now being specified for high-current and power module applications The TFC copper formulation uses a screen-printing process where the copper traces are printed on an alumina ceramic substrate and fired at temperatures up to 1000C