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Product category: Electronics Manufacturing Materials and Consumables
News Release from: Lord Corporation | Subject: ME-532 flip chip underfill
Edited by the Electronicstalk Editorial Team on 28 August 2007
Encapsulants suit lead-free soldering
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ME-532 flip chip underfill is specifically formulated to achieve high reliability for in-package or chip-on-board applications where fast flow under large chips is required.
Lord Corporation is commercialising two new capillary flow, flip chip underfill encapsulants that are compatible with lead-free solder alloy processing conditions As the demand for flip chip integrated circuits continues to increase, coupled with the legislation to limit or eliminate the use of lead in electronics, the demand for high-performance underfill encapsulants that are compatible with lead-free alloy solder reflow conditions continues to increase