Product category: Electronics Manufacturing Materials and Consumables
News Release from: Applied Microengineering | Subject: Anodic Bonder
Edited by the Electronicstalk Editorial Team on 27 March 2000
Anodic bonding joins silicon wafers to
glass
AML launches its first, new, standalone, flexible, "off-the-shelf" Anodic Bonding machine the AML-400.
AML provides another step forward for the exploitation of Microsystems in the UK, this time on the equipment front, by launching a new Anodic Bonder After strong demand and following the supply of custom Anodic Bonders (for bonding silicon wafers to glass wafers - 3 to 6in diameter), AML launches its first, new, standalone, flexible, "off-the-shelf" Anodic Bonding machine the AML-400 It benefits from years of Anodic Bonding process experience at AML
This article was originally published on Electronicstalk on 25 Feb 2004 at 8.00am (UK)
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