Click on the advert above to visit the company web site
Product category: Electronics Manufacturing Materials and Consumables
News Release from: Tecan | Subject: Electroformed wafer-bumping stencils
Edited by the Electronicstalk Editorial Team on 12 March 2001
Electroformed wafer-bumping stencils
Request your FREE weekly copy of the Electronicstalk email newsletter. News about Electronics Manufacturing Materials and Consumables and more every issue. Click here for details.
Electroformed wafer-bumping stencils from Tecan Stencils Limited (TSL) are used to accurately deposit solder paste directly onto silicon wafer die.
from Tecan Stencils Limited (TSL) are used to accurately deposit solder paste directly onto silicon wafer die Following reflow, the paste forms the conductive solder bumps required for I/O