Product category: Electronics Manufacturing Machinery and Materials
News Release from: Indium Corporation of America | Subject: WS-364
Edited by the Electronicstalk Editorial Team on 29 July 2004
Flux eases BGA bumping
WS-364 is a new high viscosity paste-flux for use in BGA bumping and board level attachment
Indium Corp has a new high viscosity paste-flux, called WS-364, designed for use in BGA bumping and board level attachment. This new water-soluble flux has excellent cleanability using room temperature water. With a wide process window, WS-364 can be applied by pin-transfer or stencil printing and offers exceptionally high yield in the BGA bumping process.
Halide-free with excellent solderability, WS-364 is suitable for Sn/Pb and Pb-free applications and is available in syringes or cartridges.
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