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Product category: Electronics Manufacturing Materials and Consumables
News Release from: AdTech Ceramics | Subject: Custom microwave and RF IC packages
Edited by the Electronicstalk Editorial Team on 20 August 2004
Novel design process boosts package
performance
A new custom package design process can yield market differentiating performance while maintaining cost effective solutions.
AdTech Ceramics has a new design process using state of the art 3D finite element method (FEM) simulators and proprietary numerical simulators that can yield market differentiating performance while maintaining cost effective solutions Custom microwave and RF IC packages can be modelled from 2 to 60GHz with transitions and interconnects which require extremely complex and accurate simulation to meet customer expectations