Product category: Electronics Manufacturing Materials and Consumables
News Release from: Huntsman Advanced Materials
Edited by the Electronicstalk Editorial Team on 20 March 2007
Electronic materials on
show in Shanghai
Huntsman Electronics has supported International Electronic Circuits Exhibition in Shanghai since 1999, and this year is presenting a range of advanced products
Huntsman Electronics has supported International Electronic Circuits Exhibition (CPCA) since 1999, and this year is presenting a range of advanced products for automotive, telecommunications, lighting and general industrial applications. A seminar on the development of Probelec 81 LD Flex will also be given during the show.
This article was originally published on Electronicstalk on 20 March 2007 at 8.00am (UK)
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Products on show on Booth 2C58 during the exhibition, which runs from 21st to 23rd March 2007 in Shanghai, China, include the following.
Azyral halogen-free laminating resins are specially formulated for the manufacture of printed circuit boards, high density interconnects and advanced package substrates.
The products meet the requirements of UL94V0 and are high temperature resistant up to 250C.
Probelec liquid dielectrics are pioneers in the build-up of microvia boards and HDI technology.
The product portfolio comprises negative or positive working photo dielectrics and thermally toughened cured systems optimised for laser ablation processing.
Further reading
Solder mask and liquid resist aid fine pitch
New materials high registration accuracy and tight clearance in LDI processing
Adhesives encapsulate, insulate and bond
A comprehensive series of high-strength epoxy and polyurethane adhesives provides encapsulation, insulation and bonding of electronic components and PCBs
Silver-filled epoxy conducts heat and current
Araldite 7047 epoxy adhesive is a high purity, 100% solids system designed for void-free bonding of circuitry and microelectronic chips to printed circuit boards
Probelec LD flex adhesives are specially suited for rigid-flex and flex circuit boards.
They can be applied on full surface or in defined discrete areas.
The adhesives bond polyimide, polyester, FR-4, copper and/or aluminium.
Probimer LDI solder mask and Probimer 355 LDI liquid resist are optimised for advanced photo speed, high resolution and high imaging accuracy for the production of HDI fine pitch BGA boards.
They can be exposed using LDI equipment or standard exposure equipment.
Probimer 65 and 77 solder mask systems meet the highest OEM requirements and offer excellent reliability in the most demanding environments.
They are ideally suited for lead-free assembly processing.
Araldite adhesives are high-performance adhesives used to bond, seal and join electronic components to printed circuit boards.
The adhesives are compatible with lead-free processing and high-speed dispensing.
Formulated for reliable, rapid bonding, the products exhibit good mechanical strength along with excellent thermal and electrical conductivity.
Araldite LED encapsulants are optoelectronic casting systems for the high-power and high-brightness light emitting diode industries.
These easy to process systems offer good nonyellowing and clarity retention properties together with reliable performance at high temperature and good thermal shock resistance.
Huntsman Electronics is also presenting a technical seminar at 1500 local time on Thursday 22nd March in Meeting Room 3 (W2-M3) on the development of new toughened liquid full epoxy dielectrics, Probelec 81 LD Flex.
Anders Ekman, Business Development and Marketing Manager Telecom will make the presentation, with translation by Product Introduction Manager Bobby Tam.
The technical seminar will show how Probelec 81 LD Flex offers a high level of flexibility combined with advanced product properties making it particularly cost effective in design and applications.
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