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Product category: Electronics Manufacturing Machinery and Materials
News Release from: Indium Corporation of America
Edited by the Electronicstalk Editorial Team on 19 March 2007

Troubleshooting and reliability in focus

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Lecture on lead-free electronics assembly at the SMT/Hybrid/Packaging Conference in Nuremberg, Germany, will emphasise troubleshooting and finished goods reliability

Indium Corp's Vice President of Technology, Dr Ning-Cheng Lee, will lecture on lead-free electronics assembly with an emphasis on troubleshooting and finished goods reliability at the SMT/Hybrid/Packaging Conference in Nuremberg, Germany from 24th to 26th April 2007. Dr Lee's presentation will emphasise implementing reliable lead-free assembly processes by overcoming technical issues and challenges.

He will focus on: lead-free legislation status; lead-free alloys, surface finishes, components and substrates; lead-free wave soldering, rework and inspection; and reliable solutions to common problems in lead-free SMT assembly.

Dr Lee, a world-renown soldering expert and SMTA Member of Distinction, has extensive experience in the development of solder alloys, solder fluxes, solder pastes, high-temperature polymers, encapsulants for microelectronics, underfills and adhesives.

His current research interests cover advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership.

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