Product category: Electronics Manufacturing Materials and Consumables
News Release from: Indium Corporation of America
Edited by the Electronicstalk Editorial Team on 2 October 2006
Lee and Lasky to
feature at lead-free workshop
Ning-Cheng Lee and Ronald C Lasky will present at 'Implementing lead-free: a hands-on workshop', at the Rochester Institute of Technology this month
Indium Corporation's Vice President of Technology, Ning-Cheng Lee, PhD, and Senior Technologist, Ronald C Lasky, PhD, PE, will present at 'Implementing lead-free: a hands-on workshop', to be held from 16th to 19th October 2006 at the Rochester Institute of Technology (RIT) Campus in Rochester, New York, USA.
This article was originally published on Electronicstalk on 2 October 2006 at 8.00am (UK)
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Dr Lee's presentation will be on the topic of lead-free system compatibility.
Dr Lasky will be speaking on applying SPC to surface mount manufacturing.
The workshop, sponsored by SMT Magazine and RIT's Centre for electronics manufacturing and Assembly (CEMA), will focus on: lead-free rework and repair; failure analysis technologies for process engineers; tin whisker mitigation; lead-free system compatibility; IPC7711 certification; and RoHS traceability, certification, and compliance.
Dr Lee, a world-renown soldering expert and SMTA Member of Distinction, has extensive experience in the development of high-temperature polymers, encapsulates for microelectronics, underfills, and adhesives.
His current research interests cover advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost ownership.
Dr Lasky, holder of the prestigious SMTA Founder's Award, is a world-renown process expert and a visiting professor at Dartmouth College.
He has over 20 years of experience in electronics and optoelectronic packaging and assembly.
He has authored or edited five books and numerous technical papers, and holds several patent disclosures.
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