Laird introduces Tlam SS LLD PCB substrate

A Laird Technologies product story

Edited by the Electronicstalk editorial team Apr 19, 2010

Laird Technologies has released its enhanced Tlam SS LLD for use as a thermally conductive printed circuit board (PCB) substrate.

The Tlam SS LLD is a versatile, thermally enhanced PCB substrate system specifically designed for heat dissipation in bright and ultra-bright LED module applications.

The substrate is said to provide 8-10 times the heat dissipation compared with conventional FR4-based PCBs.

A copper circuit layer and aluminium or copper base plate are bonded together with an LLD dielectric, which is essential to the high performance of the PCB substrate.

The dielectric can fit, and is processed through standard FR4 print-and-etch operations without various parameter modifications.

These dielectrics provide electrical isolation, thermal transfer, and an adhesion layer for the substrate.

The Tlam SS LLD boards are processed through standard pick-and-place surface-mount technology and manual wire-bond operations.

Standard constructions are made with one or two ounce copper and 0.040in or 0.059in thick aluminium, grade 5052; 0.040in or 0.062in thick aluminium, grade 6061; with a copper base available.