Product category: Electronics Manufacturing Machinery and Materials
News Release from: The Bergquist Company | Subject: Gap Filler 2000
Edited by the Electronicstalk Editorial Team on 22 February 2006
Gap-filling material is easy to apply
Gap Filler 2000 is a high-performance thermally conductive electrically isolating liquid gap-filling material supplied as a two-component room or elevated temperature curing system
Bergquist's new Gap Filler 2000 is a high-performance thermally conductive electrically isolating liquid gap-filling material supplied as a two-component room or elevated temperature curing system. Unlike cured gap filling materials, the liquid approach provides infinite thickness with little or no stress during displacement and assembly.
Related stories
Metal core PCBs keep powerful LEDs cool
Dielectric material answers extreme thermal challenges of applications using high brightness LEDs
Thermal interface material sticks to its task
Glass-fibre-reinforced silicon-based thermal interface material is designed specifically for high-volume automatic dispensing applications
It also eliminates the need for specific pad thickness and die cut shapes for individual applications.
It is used in thermal interface applications when a strong structural bond is not required.
Gap Filler 2000 is formulated for low modulus, 'gel-like' properties.
Further reading
Coated thermal plates aid safety-conscious cooling
The IsoEdge range of heatsink products can improve component packaging densities, reduce parts counts and cut the assembly costs of a wide range of electronic products
Typical applications include automotive electronics, computers and peripherals, telecommunications and any other assembly where a heat generating semiconductor must be efficiently thermally bonded to a heatsink.
In addition, Gap Filler 2000's low modulus property gives it stress absorbing flexibility.
It has a thermal conductivity of 2.0W/m-K.
The material provides a balance of cured material properties and good compression set (memory).
The result is a soft, form-in-place elastomer ideal for coupling 'hot' electronic components mounted on PC boards with an adjacent metal case or heatsink.
Before cure, it flows under pressure like a grease.
After curing it does not pump out from the interface as a result of thermal cycling.
Unlike thermal grease, the cured product is dry to the touch.
Bergquist and preferred partners also provide a complete range of dispensing equipment and expertise to enable the material to be easily implemented in the production environment.
In addition, Gap Filler 2000 allows 'clean-release' from many heatsink and electronic packaging materials, so reworking of the components is possible.
It has an excellent low and high temperature mechanical and chemical stability with a continuous use temperature range of -60 to +200C and is available with or without spacer beads to ensure a minimum stand-off.
Gap Filler 2000 is supplied as a two-part kit.
The two components are coloured to assist as a mix indicator (1:1 ratio by weight or volume).
Curing can take place at ambient or can be accelerated by using elevated temperatures to form a soft thermally conductive interface material.
The cure results in 100% solids with no byproducts and can be completed in as little as 5min at 100C.
• The Bergquist Company: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page
Related Business News
Taiwan Shares Climb 0.9 Percent
Taiwan shares rose on Thursday as investors were cheered by U.S. stock gains overnight. The Weighted Price Index of the Taiwan Stock Exchange rose 49.39 points, or 0.9 percent, to close at 8061.28.
Acxiom Agrees to Be Acquired by...
...Silver Lake and ValueAct Capital for $3.0 Billion. Acxiom Corporation announced today that it has entered into a definitive agreement to be acquired by Silver Lake, the leading investment firm focused on large-scale investments in technology-driven growth industries, and ValueAct
Opnext Reports Fourth Quarter and Full Year Operating Results
Opnext, Inc. , a global leader in the design and manufacturing of optical modules and components, today announced preliminary and unaudited financial results for the fourth quarter and full year ended March 31, 2007.
Vista Partners Updates Coverage on TXP...
...Corporation; Maintains $0.80 Price Target. Vista Partners announced today that it has update coverage on TXP Corporation . Vista Partners provides equity research to institutional and individual investors, with a focus on publicly traded small capitalization companies.
Ceasefire in Gaza Strip begins to...
...take hold ahead of Abbas visit. Gaza City, Gaza Strip (AP) - A tenuous ceasefire between rival Fatah and Hamas forces appeared to be holding Thursday, and shellshocked residents emerged from their homes to stock up on food and supplies after four days of intense fighting brought the ci
Search the Pro-Talk network of sites
