Thermoset MA-511 seals microelectronics

Lord has brought out Thermoset MA-511, a new epoxy adhesive/sealant.

Thermoset MA-511 is a one-component thixotropic epoxy material designed for use as either an adhesive or a sealant in microelectronic applications requiring high-speed dispensing.

NXP Semiconductor sought a re-workable, low-modulus, non-slumping, high-speed dispensing adhesive to cap seal its CATV module.

The previous materials used by NXP were not suitable for all cap types and so didn't provide strong enough adhesion.

Key objectives for the new project included cost reduction and material standardisation.

MA-511 has passed all reliability tests for clear caps.

Because MA-511 can be applied with an automated dispenser, it no longer produces tailing issues.

The material cures rapidly, offers excellent adhesion to a variety of plastics and its thixotropic rheology allows shape to be maintained after dispensing.

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