Cookson launches alcohol-based flux
A Cookson Electronics product story
Edited by the Electronicstalk editorial team Sep 3, 2009
Cookson Electronics Assembly Materials is introducing its Alpha EF-6103 alcohol-based flux designed to optimise solderability and reliability.
It was developed for standard and thicker high-density printed circuit-board applications in lead-free (standard SAC and Low-Ag SAC alloys) and eutectic SnPb processes.
Alpha EF-6103 is designed to minimise bridging on bottom-side QFPs, as well as performing in pin testing, hole-fill and solderballing.
It also provides Pb-free solder-joint cosmetics with an evenly spread, tack-free residue.
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