Communications ICs (Wireless)
(a sub category of Active Components)
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Latest articles from 'Communications ICs (Wireless)'
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Chipset breathes new life into 2.4GHz at 54Mbit/s
Intersil has released the industry's first WLAN chipset designed to support the new 802.11g high-rate WLAN Draft Standard.
News from Intersil, Jan 31, 2002
SoC is all-in-one wireless headset solution
The Xemics XE1218a is a complete SoC solution for small unidirectional wireless headsets.
News from Xemics, Jan 30, 2002
Intel incorporates PRISM chipset for Wi-Fi
Intel has incorporated Intersil PRISM 2.5 USB wireless technology into its new concept PC, codenamed Hannacroix.
News from Intersil, Jan 25, 2002
Mobile Internet alliance musters 14 members
Flarion Technologies has mustered 14 companies for its alliance for the development and deployment of its flash-OFDM technology for mobile IP-based services.
News from Qualcomm, Jan 17, 2002
Microwave components on short lead times
Link Microtek has produced a new shortform brochure providing an overview of the wide range of Narda microwave components now available from stock in the UK and continental Europe.
News from Link Microtek, Jan 15, 2002
Kim sets Flarion in motion in Korea
Flarion Technologies has officially opened its Asia-Pacific headquarters in Seoul, Korea, with the appointment of Hong Jin Kim as Vice President and General Manager of Flarion Asia-Pacific.
News from Qualcomm, Jan 10, 2002
Chip integrates IF to digital for critical radio
Analog Devices has a new IF digitising IC designed for radios that must meet the highest standards of reliability and performance.
News from Analog Devices, Jan 9, 2002
Power amp shrinks Bluetooth modules
The PA2423L has become the second Class 1 Bluetooth power amplifier from SiGe to be selected by CSR (Cambridge Silicon Radio) for integration on CSR's BlueCore1 modules.
News from SiGe Semiconductor, Dec 14, 2001
Frugal IrDA transceivers can stay on all the time
ZiLog has released the first devices in its new UltraSlim IrDA transceiver family designed to bring always-on, always power-efficient infra-red connectivity to compact portable systems.
News from Zilog, Dec 13, 2001
Bluetooth RF module takes antenna onboard
Philips Semiconductors has launched its new Bluetooth radio module with integrated antenna.
News from Philips Semiconductors, Dec 12, 2001
Power amp covers both Bluetooth and Wi-Fi
The SE2520L from SiGe Semiconductor is a linear 2.4GHz power amplifier that is fully compliant with both Bluetooth 1.1 and IEEE 802.11b specifications.
News from SiGe Semiconductor, Dec 12, 2001
Integrated power amp incorporates 50ohm matching
Motorola's Semiconductor Products Sector has a revolutionary concept allowing the design of cost- and size-efficient power amplifier (PA) solutions.
News from Freescale Semiconductor, Dec 10, 2001
Brain Boxes uses SiGe power amp for Bluetooth
The SiGe Semiconductor PA2423MB power amplifier has been selected by Brain Boxes for its Class 1 Bluetooth wireless products.
News from SiGe Semiconductor, Dec 7, 2001
Cypress and SiGe look to next-generation process
Cypress Semiconductor and SiGe Semiconductor have signed an agreement to collaborate on an advanced silicon germanium (SiGe) process.
News from SiGe Semiconductor, Dec 7, 2001
Chipset covers both wireless net standards
According to Synad Technologies, Mercury5G is the world's first complete dual-mode chipset, which makes it possible for the first time to build dual-standard wireless LANs.
News from Synad Technologies, Dec 5, 2001
Adaptive frequency hopping aids office Bluetooth
Bandspeed and Open Interface North America have codeveloped the first product to use adaptive frequency hopping technology to allow Bluetooth enabled devices to coexist with wireless LANs.
News from Bandspeed, Nov 30, 2001
RF Micro Devices and Hitachi in GaAs accord
RF Micro Devices and Hitachi have signed a cross-supplier agreement for GaAs HBT wafer and module design and manufacturing.
News from Hitachi Europe, Nov 29, 2001
Cable tuner chip saves set-top box power budget
SiGe Semiconductor has delivered samples of its SE3020 cable tuner IC to Matsushita Electronic Components Co for integration into the next generation Panasonic tuner module.
News from SiGe Semiconductor, Nov 29, 2001
Intersil thumbs up to 54Mbit/s wireless standard
Intersil is supporting the next generation IEEE 802.11g standard that increases wireless LAN data rates to 54Mbit/s while maintaining full backwards compatibility with existing 11Mbit/s systems.
News from Intersil, Nov 27, 2001
IBM goes for Intersil's Wi-Fi solution
IBM has chosen Intersil's Prism chipset to power its new high-rate wireless LAN gateway that enables sharing of a single broadband cable or digital subscriber line account by multiple users.
News from Intersil, Nov 21, 2001
Wi-Fi chipset enables new wireless telephony
Intersil's Wi-Fi wireless LAN technology has been incorporated into two new NetVision wireless telephone products from Symbol Technologies that deliver voice and data over a WLAN.
News from Intersil, Nov 20, 2001
Haynes joins SiGe Semiconductor
Geoff Haynes has joined SiGe Semiconductor as Marketing Manager, Wireless, bringing more than 30 years of experience in the wireless and telecommunications semiconductor industries.
News from SiGe Semiconductor, Nov 14, 2001
Processor brings wireless standards together
Bops has introduced its Mobile Wireless Processor (MWP) created in TSMC's 0.13-micron 1.2V process.
News from Bops, Nov 9, 2001
Silicon platform cuts tuner parts count
StreamCharger from SiGe is a silicon platform that enables the world's lowest power, most integrated downstream tuners for DOCSIS cable telephony equipment, cable modems and digital set-top boxes.
News from SiGe Semiconductor, Nov 7, 2001
Flarion finds funds for further expansion
Flarion Technologies has received $45 million in Series B equity financing from Cisco Systems, Nassau Capital and lead investor, Pequot Capital.
News from Qualcomm, Nov 2, 2001
Showing 1526-1550 of 1590 articles
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