Communications ICs (Wireless)
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Latest articles from 'Communications ICs (Wireless)'
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Upgraded RF process promises higher yields
Zarlink's updated H-Series processes now deliver more die per wafer and improved yields, resulting in the industry's most cost-effective process for fabricating analogue RF microchips.
News from Zarlink Semiconductor, Feb 23, 2006
SiGe sees earnings jump 63%
SiGe Semiconductor has reported that revenues for 2005 were US $31.8 million, an increase of 63% over 2004.
News from SiGe Semiconductor, Feb 23, 2006
Bluetooth chip aids handset miniaturisation
CSR BlueCore silicon has been chosen by TCL Mobile Communication, one of China's largest mobile phone manufacturers, for its latest handset, the TCLe787.
News from Cambridge Silicon Radio, Feb 22, 2006
Power amplifier is optimised for linear operation
A new gallium arsenide monolithic microwave integrated circuit power amplifier is optimised for linear operation.
News from Mimix Broadband, Feb 20, 2006
Complete GPS receiver shrinks into 96-pin BGA
The new single-chip ATR0630 measures just 7 x 10mm and integrates a complete Antaris 4 GPS receiver, including ROM-based software in a 96-pin BGA package.
News from u-blox, Feb 16, 2006
Wi-Fi chipsets gain production test support
LitePoint IQfact production test software is now available for CSR's UniFi Wi-Fi chipsets.
News from Cambridge Silicon Radio, Feb 16, 2006
Novel mobile technology boosts network quality
Announced at 3GSM in Barcelona, Broadcom MStream is a new mobile phone technology that provides significant quality and capacity improvements for 2G and 3G cellular networks.
News from Broadcom Corp, Feb 16, 2006
Alliance aims to drive 3G adoption on laptops
The GSM Association and Intel Corporation have outlined an initiative to facilitate and drive the adoption of the GSM family of technologies in laptop computers.
News from Intel Corporation, Feb 16, 2006
Freescale to incorporate Broadcom Bluetooth
Broadcom is working with Freescale Semiconductor to integrate its Bluetooth technology incorporated into the Freescale i.300 3G platform.
News from Broadcom Corp, Feb 15, 2006
Bluetooth chip adds FM radio receiver
A new device integrates a complete Bluetooth radio and baseband along with a high-performance FM stereo radio receiver into a single chip.
News from Broadcom Corp, Feb 15, 2006
Top RFID job for Wollen
Innovision Research and Technology has appointed David Wollen as CEO.
News from Innovision Research and Technology, Feb 15, 2006
Modem module makes ZigBee easy to integrate
Panasonic Industrial Europe has unveiled a ZigBee-based modem module powered by Ember's semiconductors and software for OEMs wishing to enter the fast-growing ZigBee market.
News from Ember Europe, Feb 15, 2006
Edge RF subsystem yields efficient handsets
Sagem Communication has chosen to partner with Freescale to integrate Edge RF subsystems into its next-generation family of handsets to meet consumers' demand for performance and style.
News from Freescale Semiconductor, Feb 14, 2006
3G transceiver has all bands covered
A third-generation single-chip multistandard transceiver addresses 3G cellular applications worldwide across the 850MHz, 900MHz, 1.7GHz, 1.9GHz and 2GHz bands.
News from Sony Europe - Semiconductor Division, Feb 14, 2006
Platform addresses next generation components
Broadcom Corporation has announced its new CellAirity mobile platform to enable advanced, next generation cellular handsets.
News from Broadcom Corp, Feb 14, 2006
Chipset brings 3G phones down to $100
The CellAirity multimedia mobile phone platform is claimed to help manufacturers to develop handsets with leading-edge 3G functionality at 2G price points.
News from Broadcom Corp, Feb 14, 2006
Dual low-noise amp suits all cellular basestations
The CGY2109HV is a very-low-noise very-high-linearity amplifier for all GSM, DCS, PCS and W-CDMA basestations.
News from Ommic, Feb 13, 2006
Demonstration proves Bluetooth/Wi-Fi coexistance
CSR will demonstrate a VoIP call using its single-chip Wi-Fi silicon for consumer electronic devices, UniFi-1, while simultaneously co-existing with a Bluetooth HV3 connection to a headset at 3GSM.
News from Cambridge Silicon Radio, Feb 13, 2006
Positioning system finds home in PND design
The s SE8088L high-performance positioning system features in a reference platform that provides a cost-effective and fast route to designing feature-rich GPS-enabled multimedia devices.
News from SiGe Semiconductor, Feb 13, 2006
Arrow takes ZigBee range to Southern Europe
Arrow Europe has signed a distribution agreement to market Ember Corporation's ZigBee wireless mesh networking systems throughout Southern Europe.
News from Ember Europe, Feb 10, 2006
SAW devices to help with explosives detection
RF Monolithics is participating in a Small Business Innovation Research contract to develop an improved system to detect improvised explosive devices.
News from RF Monolithics, Feb 9, 2006
Chipset enables wideband featurephones
Analog Devices will demonstrate its first W-CDMA/Edge (W-Edge) chipset at the 3GSM World Congress in Barcelona.
News from Analog Devices, Feb 9, 2006
Second-generation IC cuts handset TV system size
Kino 2 is a second-generation mobile TV device, set to bring TV to smaller phones with longer battery life and lower cost.
News from Frontier Silicon, Feb 9, 2006
Near field communication on trial at 3GSM
3GSM will be the setting for the latestest ever demonstration of near field communication technology (NFC) - the easy-to-use short range wireless technology.
News from Philips Semiconductors, Feb 8, 2006
Top technical role for Huomo
Innovision Research and Technology has appointed Heikki Huomo as Technical Director.
News from Innovision Research and Technology, Feb 7, 2006
Showing 851-875 of 1590 articles
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LPRS has been selected by Sabre-Innovation to provide wireless control links as part of a manufacturing performance system for a UK aircraft manufacturer. - LPRS provides communication for wheelchair users
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