Communications ICs (Wireless)

(a sub category of Active Components)

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Latest articles from 'Communications ICs (Wireless)'

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FM radio and Bluetooth 2.0 capability in one chip

A new low-power Bluetooth chip comprises an enhanced data rate (EDR)-compliant baseband, a radio frequency (RF) transceiver, and a worldwide FM radio receiver.

News from Marvell, Apr 16, 2007

Keynote to expose fabless supply chain

Nemerix CEO Ron Torten will deliver a keynote on "Winning the supply chain challenges in a fabless model" at the IET and FSA International Semiconductor Forum in Paris.

News from Nemerix, Apr 13, 2007

Dual-mode radio chip passes Bluetooth test

The Marvell 88W8688 has been qualified by the Bluetooth SIG for the Bluetooth Core Specification Version 2.0 + EDR.

News from Marvell, Apr 13, 2007

EDGE mobile phones built around Nexperia platform

China's biggest mobile-handset maker is using NXP technology to develop cost-effective EDGE phones for the Chinese market, which currently consists of 400 million subscribers.

News from NXP (formerly Philips Semiconductors), Apr 9, 2007

Taipei seminar to discuss mobile digital TV

Several industry leaders will gather at the Taipei International Convention Centre on 9th May to examine the evolving MDTV market and debate critical aspects of its ecosystem.

News from Siano Mobile Silicon, Apr 9, 2007

Alliance to tackle Japanese mobile TV market

UK chipmaker is teaming up with a partner to raise interest in its universal broadcast receiver technology in the burgeoning Japanese market for mobile TVs.

News from Mirics Semiconductor, Apr 6, 2007

Alliance targets 900MHz-band ZigBee chipset

Joint development agreement enables Renesas to combine ZMD's RF technology with its own microcontrollers to develop a 900MHz band ZigBee chipset.

News from Renesas Technology Europe, Apr 5, 2007

Bluetooth devices upgrade voice performance

Aurisound's Adaptive Focus-Beam technology is aimed at Bluetooth in-car hands-free kits, headsets and mobile phones.

News from Cambridge Silicon Radio, Apr 3, 2007

Wireless infrastructure chip starts sampling

Toumaz Technology has delivered the first silicon from Infineon Technologies' advanced 130nm RF CMOS process.

News from Toumaz Technology, Apr 3, 2007

Doubler provides cost-effective control

Device combines an active doubler with an output buffer amplifier and provides an ideal solution for a variety of applications.

News from Mimix Broadband, Apr 2, 2007

Broadband radio specialist receives award

A company prominent in the development of high-performance envelope-tracking technology to improve RF power amplifier efficiency, has been named as a recipient of the Red Herring 100 Europe award.

News from Nujira, Apr 2, 2007

Kit is quick start for RFID applications

RFID demo kit enables evaluation and prototyping of low-frequency devices used in a broad range of RFID applications from access control to animal identification.

News from Atmel Corporation, Mar 30, 2007

Morgan brings commercial and financial experience

Bernard Morgan is the new Chief Financial Officer at RF power amplifier innovator Nujira.

News from Nujira, Mar 30, 2007

IEEE standard adds to chirp support

The Institute of Electrical and Electronics Engineers (IEEE) has approved the chirp spread spectrum (CSS) physical layer (PHY) in its new wireless standard 802.15.4a.

News from Nanotron Technologies, Mar 30, 2007

Alliance brings harmony to location services

Motorola and SiRF have agreed to harmonise their respective location-enabling APIs, making it easier for location applications to be deployed across a wide range of handsets.

News from SiRF Technology, Mar 30, 2007

Qualcomm supports CDMA Smartphones

Qualcomm's Mobile Station Modem (MSM) MSM7525 for CDMA2000 1xEV-DO Rev A devices will enable cost-effective Smartphones with advanced capabilities to be more readily affordable to wireless users.

News from Qualcomm, Mar 29, 2007

Japanese survey shows support for mobile TV

Qualcomm and KDDI Corp have announced encouraging results from an extensive consumer survey of attitudes towards mobile TV.

News from Qualcomm, Mar 29, 2007

Low frequency transponder chip has global appeal

Read/write transponder IC features a unique ID and extended read/write distance and has been optimised for next-generation access control applications.

News from Atmel Corporation, Mar 29, 2007

Wireless MCU brings down the cost of ZigBee

Low-cost reference design for wireless microcontroller reduces the volume bill of materials cost of modules for wireless sensor networks to well under $5.

News from Jennic, Mar 29, 2007

Alliance targets Digital Radio Mondiale expansion

STMicroelectronics and the Fraunhofer Institute for Integrated Circuits are to jointly develop a dedicated low-power ASIC for Digital Radio Mondiale applications.

News from STMicroelectronics, Mar 29, 2007

Single-chip products boost mobile-phone handsets

Single chip products reduce the cost of adding advanced multimedia features to mobile phones in developing markets.

News from Qualcomm, Mar 28, 2007

Radio SoC on the shortlist

WirelessUSB LP radio SoC is a finalist for CMP Technology's EE Times third Annual Creativity in Electronics Awards for 2007.

News from Cypress Semiconductor, Mar 28, 2007

Chirp spread spectrum is basis for new standard

The ISO and IEC have jump-started a new standard for real time locating systems based on chirp spread spectrum technology.

News from Nanotron Technologies, Mar 28, 2007

Single-chip handset accelerates to 1xEV- DO Rev A

The new QSC6085 solution for CDMA2000 1xEV- DO Rev A will deliver more than ten-times the speed of EV-DO Rel 0.

News from Qualcomm, Mar 27, 2007

Chipset is first device solution for EV-DO Rev B

The MSM7850 solution provides manufacturers with a highly integrated, flexible solution to deliver the capabilities of Rev B on consumer products.