Product category: Communications ICs (Wireless)
News Release from: NXP (formerly Philips Semiconductors) | Subject: BGB100A
Edited by the Electronicstalk Editorial Team on 11 December 2001
Bluetooth RF module
takes antenna onboard
Philips Semiconductors has launched its new Bluetooth radio module with integrated antenna
The BGB100A is the smallest module with full Bluetooth RF functionality available in the marketplace. The new advanced antenna concept enables easy and fast design-in for a wide range of portable devices. The BGB100A will address manufacturers' demands for highly integrated Bluetooth RF solutions.
This article was originally published on Electronicstalk on 11 December 2001 at 8.00am (UK)
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Its embedded antenna is extremely tolerant to variations in the end products and their functions.
The antenna does not alter the form factor or the appearance of the radio module, enabling designers to decrease design time, resulting in a reduced time to market.
"We are listening to our customers and providing designers with exactly the kind of integrated solutions they require", said Guido de Vocht, business development manager at Philips Semiconductors.
"We understand that miniaturisation, easy design-in and performance are key drivers within the marketplace and the BGB100A offers an ideal solution to these problems.
This is yet another example of Philips Semiconductors taking the lead in the development of RF technology".
Traditionally, reduced antenna size results in reduced tolerance to variations, leading to long design-in procedures.
Philips Semiconductors has resolved this issue as the BGB100A contains a novel Bluetooth antenna that offers reduced size and improved robustness.
The new product is designed to achieve the same performance in different conditions, minimising the need to retune, making it one of the most advanced antenna solutions available.
Philips Semiconductors is working closely with other partners to develop a cost-effective means of integrating antenna functions into Bluetooth devices.
These partnerships have helped the development of minimum design-in requirements through the integration of the antenna in the substrate of the Bluetooth module, and the use of plug and play antenna structures.
By co-operating with leading antenna manufacturers, Philips Semiconductors is able to offer its customers access to innovative best-in-class products for Bluetooth antennas.
Prototypes are scheduled for Q1 2002.
The first products will be available in Q3 2002.
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