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Latest articles from 'Communications ICs (Wireless)'

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Showing 551-575 of 1590 articles

Asus adopts single-chip Bluetooth

Advanced Bluetooth silicon and software technology from Broadcom has been used by Asustek Computer in several new connected PDA products.

News from Broadcom Corp, Feb 15, 2007

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Mobile TV services for Cingular subscribers

Mediaflo USA , a subsidiary of Qualcomm, has signed a definitive agreement to deliver mobile entertainment and information services to subscribers to Cingular, the new wireless unit of ATandT.

News from Qualcomm, Feb 14, 2007

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Single chip FM radio transceiver on display

Silicon Laboratories is demonstrating a single-chip FM radio transceiver family at 3GSM World Congress.

News from Silicon Laboratories, Feb 14, 2007

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GPS receivers cut power and cost

Compact Global Navigation Satellite System (GNSS) receiver ICs suit mobile handsets, cellular telephones and personal digital assistants (PDAs).

News from SiGe Semiconductor, Feb 14, 2007

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Versatile chip in miniature package

Silicon Laboratories has anounced a mixed-signal 8bit MCU family that offers 100MHz CPU operation in a 5x5 mm package.

News from Silicon Laboratories, Feb 14, 2007

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Chipset helps LG provide 3G for all

The LG KU250 handset is powered by Qualcomm's chipset technology to deliver a wide range of advanced wireless features that meet operators' specifications.

News from Qualcomm, Feb 14, 2007

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MMICs address high-reliability applications

Link Microtek has a family of MMIC components in LH5 leadless hermetic SMT packages, making them ideal for use in high-reliability applications in the space, industrial and military sectors.

News from Link Microtek, Feb 14, 2007

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RFICs help simplify power amplifier system designs

RF integrated circuits are capable of delivering the 100W RF output power required for GSM and Edge network basestations.

News from Freescale Semiconductor, Feb 14, 2007

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Multiband transceiver has global appeal

Single-chip CMOS transceiver provides global roaming capabilities with multiband UMTS and quad-band Edge.

News from Qualcomm, Feb 14, 2007

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Mobile platform speeds GPRS handset to market

The Broadcom CellAirity platform for mobile phone designs has been adopted by Lenovo for its recently introduced P768 multimedia GPRS handset.

News from Broadcom Corp, Feb 14, 2007

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Mobile broadcast technology demonstrated at 3GSM

Qualcomm and Abertis Telecom are conducting a live demonstration of MediaFLO mobile broadcast technology during 3GSM World Congress 2007in Barcelona, Spain.

News from Qualcomm, Feb 13, 2007

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GPS interoberability testing in London complete

NEC Corporation, NEC Europe and SiRF Technology Holdings have successfully completed a program of assisted-GPS (A-GPS) interoperability testing in London on a commercial GPRS/WCDMA network.

News from SiRF Technology, Feb 13, 2007

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SiRF works with Philips on low-cost 3G handsets

SiRF Technology Holdings is to collaborate with NXP Semiconductors, newly independent from Philips, to speed the development of cost-effective, location-aware 3G wireless handsets.

News from SiRF Technology, Feb 13, 2007

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Wireless industry trends discussed 3GSM

In addition to showcasing a wide range of innovative wireless solutions, Qualcomm executives will discuss key wireless industry trends this week at 3GSM.

News from Qualcomm, Feb 13, 2007

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Cellular chip design available in ASIC form

Cellular3G has implemented its TopHat W-CDMA chip design in 90nm Nextreme family of structured ASICs.

News from eASIC Corp, Feb 13, 2007

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Kamp to bring analogue/RF expertise

Peter Kamp is set to join H-Stream Wireless as Director of Analog/RF Engineering.

News from H-Stream Wireless, Feb 13, 2007

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Transceiver and baseband unite in single-chip Edge

Edge processor integrates Edge RF transceiver, all analogue and digital baseband functions and high performance multimedia and connectivity support.

News from Broadcom Corp, Feb 13, 2007

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NXP to purchase RF technologies

Silicon Laboratories has reached a definitive agreement for NXP to purchase its Aero transceiver, AeroFone single-chip phone and power amplifier product lines.

News from Silicon Laboratories, Feb 13, 2007

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WiMAX in focus at 3GSM

Fujitsu Microelectronics Europe is exhibiting its WiMAX devices, demonstrating its WiMAX solutions and unveiling its WiMAX SoC roadmap at the 2007 3GSM World Congress in Barcelona.

News from Fujitsu Microelectronics Europe, Feb 13, 2007

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3GSM showing for 65nm handset devices

Broadcom is showcasing new 65nm products for mobile handsets and handheld devices at this week's 3GSM World Congress in Barcelona, Spain.

News from Broadcom Corp, Feb 13, 2007

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Test system supports Assisted GPS development

Nemerix has standardised its GPS testing activities on Spirent's new ULTS-ADS testing platform.

News from Nemerix, Feb 13, 2007

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GPS ICs gain assistance for free

Extended Ephemeris solution enables mobile devices to acquire immediate positioning information "deep-indoors", in difficult garage scenarios, and in the harshest multipath environments.

News from Nemerix, Feb 13, 2007

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Voice over Wi-Fi design drives SunCorp handset

CSR has announced that its Wi-Fi (802.11 b/g) voice over Wi-Fi (VoWi-Fi) design, UniVox, has been selected by SunCorp Technologies for its first generation of Wi-Fi handsets.

News from Cambridge Silicon Radio, Feb 13, 2007

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VoWiFi design provides DECT-quality handsets

Accton's VM8168C phones have been designed around UniVox, CSR's VoIP phone example design, which uses UniFi, the company's single-chip Wi-Fi technology.

News from Cambridge Silicon Radio, Feb 13, 2007

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Chipset is first to support HSPA+

Qualcomm will sample the Mobile Data Modem (MDM) MDM8200 solution, the first chipset supporting HSPA+, by the end of 2007.

News from Qualcomm, Feb 13, 2007

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Showing 551-575 of 1590 articles

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