Communications ICs (Wireless)

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Latest articles from 'Communications ICs (Wireless)'

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Showing 1501-1525 of 1590 articles

Transimpedance amplifier stabilises 10Gbit systems

SiGe Semiconductor has added the SE1050 10Gbit/s transimpedance amplifier (TIA) to its LightCharger portfolio of optical interface components.

News from SiGe Semiconductor, May 23, 2002

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Flarion's Dolan speaks in New York today

Ray Dolan, CEO of Flarion Technologies, will present Flarion's approach to profitable mobile broadband data as a featured presenter at Lehman Brothers' Third Annual Global Wireless Conference.

News from Qualcomm, May 22, 2002

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Smart label IC supports GTAG RFID standard

The I.Code HSL (high-frequency smart label) chip from Philips Electronics is the first to support the EAN.UCC GTAG programme.

News from Philips Semiconductors, May 16, 2002

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Flarion named "one to watch"

Flarion Technologies has been named as one of the companies on the Red Herring "Top Ten to Watch List".

News from Qualcomm, May 15, 2002

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W-Link uses SiGe Bluetooth power amplifier

W-Link is using the RangeCharger-based PA2423MB power amplifier from SiGe Semiconductor to drive its Class 1 Bluetooth products.

News from SiGe Semiconductor, May 9, 2002

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Five more join the Flarion fan club

Flarion Technologies has lined up further market support for its flash-OFDM technology, with five new members joining its technology alliance.

News from Qualcomm, May 1, 2002

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Reference design points to optical mice

Cypress Semiconductor has developed a combination USB-PS/2 optical mouse reference design for PC pointing devices.

News from Cypress Semiconductor, Apr 17, 2002

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Trio collaborate on microwave stocks

Link Microtek has set up a new European hub arrangement that is enabling customers in the UK and across Europe to benefit from much shorter delivery times for products made by Narda Microwave.

News from Link Microtek, Apr 15, 2002

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SOHOware combines Intersil Wi-Fi with broadband

SOHOware has adopted Intersil's Prism WLAN technology as the basis of its new CableFree NetBlaster 11 wireless system specifically designed for the SOHO market.

News from Intersil, Apr 3, 2002

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High-security encoders take transmitters onboard

A pair of new wireless encoders combine a built-in RF transmitter with the highly secure Keeloq access control system.

News from Microchip Technology, Mar 29, 2002

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CSR picks SiGe power amp for Bluetooth designs

Cambridge Silicon Radio has chosen SiGe's PA2423L Class 1 Bluetooth power amplifier for its BlueCore2 reference design.

News from SiGe Semiconductor, Mar 28, 2002

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Agilent combines with Tropian for multimode GSM

Tropian and Agilent Technologies have developed a complete RF transmitter solution for GSM/GPRS/Edge handset applications.

News from Agilent Technologies, Mar 21, 2002

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Successful mobile broadband demo at Orlando show

Flarion Technologies demonstrated the future of mobile broadband during the opening keynote sessions at CTIA in Orlando.

News from Qualcomm, Mar 20, 2002

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Flarion hits the road with mobile mobile demo

Flarion Technologies is demonstrating a true broadband experience for mobile users in major cities throughout the USA.

News from Qualcomm, Mar 13, 2002

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Tecom picks SiGe power amplifier for Bluetooth

Tecom has selected the SiGe Semiconductor PA2423MB power amplifier for its cordless phone and Class 1 Bluetooth wireless products.

News from SiGe Semiconductor, Mar 6, 2002

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Intersil and Cisco work towards new IEEE standard

Intersil and Cisco Systems are collaborating on high-speed WLAN client adapter reference designs for the in-progress IEEE802.11g draft standard for datarates up to 54Mbit/s at 2.4GHz.

News from Intersil, Feb 28, 2002

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Semiconductor passive integration shrinks RF amp

Royal Philips Electronics has developed an innovative new semiconductor passive integration technology which will offer handset manufacturers highly integrated, low-cost solutions for mobile handsets.

News from Philips Semiconductors, Feb 27, 2002

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Funds drive wireless innovation

Ember Corporation has secured an additional $5 million in series A funding.

News from Ember Europe, Feb 26, 2002

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Chipset provides full Bluetooth 1.1 solution

Hitachi has released its first Bluetooth chipset for short-range radio communications.

News from Hitachi Europe, Feb 21, 2002

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Better noise immunity from new FEC technology

Flarion Technologies is claiming another technological achievement with the availability of its forward error-correction (FEC) technology based on low-density parity-check (LDPC) codes.

News from Qualcomm, Feb 21, 2002

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Triple-band chipset reduces 2.5G risks and costs

Philips Semiconductors has launched its next-generation GPRS system solution for the development of low-risk low-cost highly integrated 2.5G GSM/GPRS cellular handsets anywhere in the world.

News from Philips Semiconductors, Feb 20, 2002

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IC reinvents radio receiver architecture

Philips Semiconductors is claiming a breakthrough with the launch of a family of fully integrated single-chip stereo radios for low-voltage and low-power applications.

News from Philips Semiconductors, Feb 13, 2002

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RF transceiver balances cost with performance

Xemics has developed a highly integrated ultra-low-power RF transceiver it claims enables flexible solutions with a minimal number of external components.

News from Xemics, Feb 13, 2002

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WLAN chipset used in hospital telephone system

SpectraLink is using Intersil's Prism wireless LAN technology as part of a voice over Internet protocol (VoIP) wireless telephone system in Guy's and St Thomas' Hospital.

News from Intersil, Feb 12, 2002

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Transceiver has all GSM standards covered

Sony Semiconductor and Devices Europe (SDE) has designed its first Quadband GSM/GPRS/Edge transceiver, the DuettoDC.

News from Sony Europe - Semiconductor Division, Feb 5, 2002

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Showing 1501-1525 of 1590 articles

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