Product category: Communications ICs (Wireless)
News Release from: Broadcom Corp
Edited by the Electronicstalk Editorial Team on 13 February 2007
3GSM showing for 65nm handset devices
Broadcom is showcasing new 65nm products for mobile handsets and handheld devices at this week's 3GSM World Congress in Barcelona, Spain.
Broadcom is showcasing new 65nm products for mobile handsets and handheld devices at this week's 3GSM World Congress in Barcelona, Spain With the industry's broadest communications IP technology portfolio, coupled with new 65nm technologies, the demonstrations at 3GSM illustrate how Broadcom has squeezed a greater number of robust features within smaller board spaces and slimmer mobile handset designs
This article was originally published on Electronicstalk on 19 Oct 2005 at 8.00am (UK)
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Featuring the industry's highest integration, lowest power consumption, smallest size and lowest bill of materials (BOM) available, Broadcom's new 65nm mobile and wireless products are all available today.
The 65nm process is the most advanced lithographic node for manufacturing semiconductors in large volumes today and provides significant benefits over 90nm and 130nm processes by enabling lower power consumption, smaller size, higher yields and higher levels of integration.
For Broadcom, the move to 65nm process technology is changing the competitive landscape because of the breadth and depth of the communications intellectual property the company possesses.
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