Miniature photocoupler is big on protection
A Toshiba Electronics Europe product story
Edited by the Electronicstalk editorial team Mar 28, 2008
The TLP700 is ideal for saving space in applications that require the reinforced isolation demanded for international safety certification.
Toshiba Electronics Europe (TEE) has launched a miniature photocoupler that delivers the same isolation and current outputs as previous DIP packaged devices in a form factor that is 50% smaller.
The new TLP700 is ideal for saving space in applications that require the reinforced isolation demanded for international safety certification.
The TLP700 has an isolation voltage of 5000Vrms and a common mode transient immunity rating of +/-10kV/us.
Suitable for use in IGBT and power MOSFET gate drive circuits, the device has a peak output current of 2.0A, allowing it to directly drive some low power IGBTs up to around 50A.
Operating with a supply voltage between 15 and 30V, the TLP700 keeps power consumption to a minimum through a maximum supply current of just 2mA.
Maximum switching time is rated at 500ns.
The new photocoupler comprises a GaAlAs infra-red LED and a photodetector IC in the latest SDIP six-pin packaging measuring just 6.8 x 4.58 x 3.65mm.
The device has been designed to meet the requirements of all relevant international safety approvals and delivers guaranteed performance at temperatures between -40 and +100C.
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