PCB Assembly Equipment, Tools
(a sub category of Electronics Manufacturing, Production, Packaging)
Latest articles from 'PCB Assembly Equipment, Tools'
News releases from this sub-category
Showing 901-925 of 1082 articles
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Ovens filter for cleaner air
A clean process oven offering high-performance HEPA filtration for processes where minimal contamination is essential has been introduced to Europe by Alliance Sales (Europe).
News from Alliance Sales (Europe), Jan 6, 2003
Sole status for UK distribution deal
Blundell Production Equipment has been appointed the sole UK distributor for the TWS range of SMD placement and reflow soldering equipment.
News from Blundell Production Equipment, Jan 6, 2003
High-speed machine takes on larger boards
Universal Instruments reckons the 4797L HSP Chipshooter is the fastest large-board-capable high-speed machine on the market.
News from Universal Instruments Corp, Jan 6, 2003
Pump goes beyond the pail
The Fisnar 560092A manual pail pump provides an inexpensive solution to the problem of extracting bulk viscous materials from 19 litre straight-sided cans.
News from Intertronics, Dec 25, 2002
Local accolade for DEK
Weymouth-based DEK has received the Business In The Community Award, part of the Dorset Business Awards 2002.
News from DEK, Dec 23, 2002
Applying adhesives accurately at speed
As placement systems begin to process up to 80,000 components an hour, it's important to rethink other SMT assembly processes - especially the bottleneck of dispensing adhesives, says Mike O'Hanlon.
News from DEK, Dec 16, 2002
Programmable UV source is a flexible cure
A novel programmable feedback UV light source maintains extremely stable UV irradiation from a quartz halogen lamp through proprietary optical feedback control.
News from Moritex Europe, Dec 16, 2002
SMT materials are match for printers
Ekra and the Circuit Material Division of WC Heraeus have signed a agreement under which EKRA will recommend the use of Heraeus SMT materials with its range of printers.
News from Ekra, Dec 12, 2002
System cleans screens even more effectively
The Vortex Plus under-screen cleaning system from DEK now cleans screens even more effectively in a single pass, through use of a new two-dimensional cleaning action.
News from DEK, Dec 11, 2002
Software makes the most of placement machine
Universal Instruments has complemented the latest hardware enhancements to its GSM placement platform with new UPS+ control software.
News from Universal Instruments Corp, Dec 10, 2002
Handy needle-valve dispensing pen
The I and J Fisnar JC1015 is a convenient and lightweight dispensing tool which operates by pressing a finger-switch to actuate a needle valve.
News from Intertronics, Dec 6, 2002
Irvine takes on complete SMT line
Universal Instruments has installed a complete line solution for Irvine Electronics.
News from Universal Instruments Corp, Dec 5, 2002
Sharma takes charge of information
DEK has appointed Pamal Sharma as Chief Information Officer.
News from DEK, Dec 2, 2002
Placement alliance survives acquisition
Hitachi High-Technologies and Universal Instruments are to continue their successful OEM business for turret-style high-speed placement equipment.
News from Universal Instruments Corp, Dec 2, 2002
Inline technology aids wafer-level processing
Neil MacRaild of DEK explains how back-end packaging processes and technology must become more flexible for manufacturers to produce today's advanced packages at commercial prices.
News from DEK, Nov 27, 2002
Repair kit gets PCBs back in shape
A handy new kit from Intertronics contains virtually everything needed to repair most types of damage to assembled or bare printed circuit boards.
News from Intertronics, Nov 27, 2002
Mass measurement is front-line inspection process
A novel solder paste inspection system aims to provide paste inspection on 100% of every board with no programming requirements, negligible setup time and no impact on throughput.
News from DEK, Nov 26, 2002
IC packaging and board assembly converge
Only dynamic organisations will be able to work with, rather than against, the convergence of back-end component packaging and front-end assembly, argues Richard Heimsch of DEK International.
News from DEK, Nov 25, 2002
System prepares samples for SEM and TEM
An automatic polisher that offers rapid sample preparation for SEM and TEM inspection in one tool has been introduced in Europe by Alliance Sales (Europe).
News from Alliance Sales (Europe), Nov 21, 2002
Fully modular assembly solution
Universal Instruments has enhanced its GSM platform for surface mount component placement.
News from Universal Instruments Corp, Nov 21, 2002
Big turnout to see Polaris
More than 150 professionals from 50 different companies recently attended the second Universal Instruments/Asys Technology Day.
News from Universal Instruments Corp, Nov 21, 2002
Mass imaging technology handles 300mm wafers
DEK has successfully deployed a production wafer bumping solution for 300mm wafers at customer sites in Asia.
News from DEK, Nov 20, 2002
Foot-pedal dispenser saves bench space
The Fisnar DB815 foot pedal dispensing system from Intertronics not only saves cost but also saves valuable bench space.
News from Intertronics, Nov 19, 2002
SMT printer distribution network grows
Dorset-based manufacturer Reprint Services has expanded the worldwide availability of its range of SMT screen printers with the appointment of three new distributors.
News from Reprint Services, Nov 19, 2002
Insertion machine speeds through larger PCBs
Anyone looking for versatile and efficient component placement on large boards or high production volumes, will welcome the introduction of the P300 insertion machine.
News from Tyco Electronics - Global Application Tooling, Nov 19, 2002
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