PCB Assembly Equipment, Tools
(a sub category of Electronics Manufacturing, Production, Packaging)
Latest articles from 'PCB Assembly Equipment, Tools'
News releases from this sub-category
Showing 751-775 of 1082 articles
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Two wins for automatic placement system
Both Data Track Technology and ECM have selected the automatic Essemtec CLM9000 style of placement system with vision capabilities.
News from Contax, Jan 14, 2004
Compact footprint platform handles bigger boards
Universal Instruments has trimmed the footprint and increased the maximum board size for its high-speed placement platform.
News from Universal Instruments Corp, Jan 9, 2004
Wire bonding on a budget
The low-cost TPT HB10 bonder, configured for ball and wedge bonding, is suitable for low through medium volume production of microelectronic, microwave or photonic devices.
News from Inseto, Jan 8, 2004
Lin adds to Chinese knowledge base
Universal Instruments has extended the capabilities and expertise of its Suzhou, China, technology laboratory by appointing Dr Kon M Lin as process support manager.
News from Universal Instruments Corp, Dec 24, 2003
Green cleaning boosts productivity and quality
Contract manufacturing specialist JJS Electronics has increased productivity and improved cleaning quality after installing a cosolvent cleaning system.
News from Kerry Ultrasonics, Dec 23, 2003
Novel dry PCB cleaner improves bond quality
The Plasmapen is a novel automated cleaning tool that prepares PCBs and LCDs for stronger and more reliable heat-seal connections and anisotropic conductive adhesive bondings.
News from Unitek Eapro, Dec 23, 2003
Automatic crimping adds value for Irish CEM
Elite Electronics, Northern Ireland's leading contract electronics manufacturer has purchased the new Komax Gamma 333PC, a fully automatic crimping machine from Contax.
News from Contax, Dec 8, 2003
Effective replacement for 141B cleaning
Kerry Ultrasonics is experiencing a significant increase in the number of enquiries received from customers seeking an alternative cleaning method to the use of solvent HCFC 141B.
News from Kerry Ultrasonics, Dec 8, 2003
Productronica visitors win prizes
At the recent Productronica exhibition, Universal Instruments' Global Services Division ran a series of daily draws with prizes valued around Eur 1500.
News from Universal Instruments Corp, Dec 8, 2003
Collaboration aids monitoring and traceability
Aegis Industrial Software, a leader in electronic assembly software has joined the Universal third party software programme.
News from Universal Instruments Corp, Dec 3, 2003
Inline printer handles both screens and stencils
A novel fully automatic high-performance inline features CANopen control to reduce manufacturing costs, improve maintainability and increase flexibility.
News from Ekra, Dec 1, 2003
Lightning speed from novel placement head
The high-speed Lightning placement head extends the performance of both Genesis and AdVantis platform systems.
News from Universal Instruments Corp, Dec 1, 2003
Pair join forces to share SMT knowledge
Universal Instruments is to provide SMT placement capabilities at service centres owned by WC Heraeus in Germany and China.
News from Universal Instruments Corp, Nov 26, 2003
German startup joins distribution network
Universal Instruments has appointed SmartTec as a distributor in Germany to augment its European sales and support infrastructure.
News from Universal Instruments Corp, Nov 26, 2003
Upgraded bonding heads ease reflow tasks
A new and improved range of bonding heads is available for all hot-bar reflow soldering and heat-seal bonding applications.
News from Unitek Eapro, Nov 26, 2003
Oven is ideal for lead-free processing
The Essemtec RO300FC is a new full convection reflow oven for high-temperature soldering of sensitive electronics, and is an ideal solution for lead free soldering.
News from Contax, Nov 25, 2003
Variable foil stencil provides superior printing
The VectorGuard stencil is designed to optimise flexibility, performance and resilience.
News from DEK, Nov 24, 2003
Speedy inspection for printed boards
Cyberscan is a new option for all inline printers of Ekra's E and X series that allows 100% 2.5D post-print inspection accelerated by a factor of 120 during the printing process.
News from Ekra, Nov 24, 2003
Speedy printer suits high-volume lines
The X5 II HSP is an inline stencil and screen printer especially designed to further reduce cycle times in production lines with high volumes and high throughput rates.
News from Ekra, Nov 24, 2003
New dimension to solder print analysis
Ekra has developed a novel 3D post-print inspection (PPI) system for the complete analysis and assessment of solder printing during the printing process.
News from Ekra, Nov 21, 2003
Printers gain code reader options
Ekra has added a new option for all its inline printers, enabling them to read barcodes and data matrix codes.
News from Ekra, Nov 21, 2003
Hybrid printer combines precision and flexibility
The MX-2 is a new semi-automatic screen and stencil printer designed specifically to meet exacting precision and reliability requirements.
News from Ekra, Nov 21, 2003
Bench terminator provides reliable performance
A new bench termination machine has been specifically designed to deliver superior performance and reliability.
News from Tyco Electronics - Global Application Tooling, Nov 21, 2003
Programme boosts support for Italian manufacturers
Assembleon Italia has introduced a multifaceted programme to boost its support for customers in Italy.
News from Assembléon, Nov 19, 2003
Technology days explain lead-free manufacturing
DEK is to host advanced manufacturing technology days at its Weymouth headquarters on 2nd and 3rd December 2003.
News from DEK, Nov 19, 2003
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