PCB Assembly Equipment, Tools
(a sub category of Electronics Manufacturing, Production, Packaging)
Latest articles from 'PCB Assembly Equipment, Tools'
News releases from this sub-category
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Nitrogen generators boost lead-free reliability
Soldering in nitrogen greatly improves joint quality when using lead-free solder by removing the possibility of oxidisation which can weaken joints and result in unreliable connections.
News from Domnick Hunter, Jun 5, 2006
Parafix adds value to adhesive placement
Parafix Tapes and Conversions has been confirmed as a value added reseller for AccuPlace's product line of film adhesive placement machines.
News from AccuPlace, Jun 5, 2006
Wave soldering range covers all volumes
ATF wave soldering machines are all fully lead-free compatible and offer a very high specifications in a compact unit.
News from Contax, Jun 5, 2006
Siemens to integrate material control system
Cogiscan has entered into a long-term technology alliance with Siemens that includes joint product development and marketing of Cogiscan Smart Material Control solutions.
News from Cogiscan, May 30, 2006
Ultrasonic irons can solder the unsolderable
Ultrasonic soldering irons are engineered to allow fluxless soldering, creating a more environmentally friendly working atmosphere and helping compliance with lead-free solder legislation.
News from Solbraze, May 23, 2006
Reflow oven answers lead-free demands
Answering the need for increased reflow temperatures mandated by the adoption of lead-free solder, Phase 1 Electronics of Portsmouth has acquired a Dima Solano reflow oven.
News from Kaisertech, May 19, 2006
Package deal cuts the cost of pick and place
Until 1st September 2006, Assembleon is offering its highly versatile Opal-XII pick and place machine for an all-in price of Eur 69,000.
News from Assembléon, May 17, 2006
Platform shows up at Semicon West
Universal Instruments will be using Semicon West to demonstrate its latest platform placement system, the AdVantis XS.
News from Universal Instruments Corp, May 16, 2006
Post-print verification doesn't miss a beat
For production of today's electronics products, process speed is the name of the game and, until now, keeping up with the line beat rate meant sacrificing thorough inspection.
News from DEK, May 15, 2006
Newsletter is dedicated to film adhesive world
AccuPlace has launched a quarterly newsletter for customers and everybody being interested in the film adhesive world.
News from AccuPlace, May 15, 2006
Dispensing systems are accurate and affordable
The DX-200 Series of digital dispenser/controllers are affordable, accurate and repeatable micro-air dispensing systems.
News from OK International, May 12, 2006
Film adhesive solutions on show in Tokyo
Accuplace will exhibit at the ISW show in Tokyo in June.
News from AccuPlace, May 11, 2006
Workstations demonstrate flexible production
Production automation system specialist Contax will demonstrate a range of Sigma semi-automated workstations on Stand D20 at Nepcon UK 2006.
News from Contax, May 10, 2006
Print and pick and place come together at Nepcon
On show for the first time in the UK at Nepcon will be the Essemtec FLX2020 SMT pick and place machine and the SP200AV fine-pitch printer.
News from Contax, May 10, 2006
Ultra-low-humidity cabinets keep components safe
Many manufacturers have purchased McDry humidity cabinets from Contax to store and protect their components and PCBs.
News from Contax, May 1, 2006
Award recognises industrial excellence
The Electronics Assembly Systems Division of Siemens's Automation and Drives Group has won second place in the 2006 Best Factory/Industrial Excellence Award.
News from Siemens Automation and Drives EAS, May 1, 2006
DEK leads world in SMT screen printers
Frost and Sullivan's recent analysis of the world SMT screen printers markets selected DEK International as the recipient of its award for market leadership.
News from DEK, Apr 27, 2006
Lead-free process advice available at Nepcon
Visitors to Nepcon UK will be able to discuss their lead-free process issues and requirements with OK International.
News from OK International, Apr 25, 2006
Assembly systems join in lead-free experience
Siemens Electronics Assembly Systems is supporting the SMART Group Lead-Free Experience at this year's Nepcon UK in Birmingham.
News from Siemens Automation and Drives EAS, Apr 25, 2006
Board cleaner banishes dust and static
The new CL-SMT MK3 contact cleaning unit is used to preclean SMT boards to remove all dust, loose surface particles and static before screen printing.
News from Microclean Technologies, Apr 24, 2006
Puis promotes process support products
Pascal Puis has been appointed to the position of DEK France Operations Manager.
News from DEK, Apr 24, 2006
Post-print verification on show in Boston
DEK will exhibit with Matrix Sales on Booth 2045 at Nepcon East on 10th and 11th May 2006 at the New Boston Convention and Exhibition centre in Boston, Massachusetts.
News from DEK, Apr 24, 2006
Handheld convection tool aids rework
A handheld convection tool has the flexibility to handle a wide range of thermally demanding production and rework applications, including lead-free.
News from OK International, Apr 21, 2006
Pick and place machine handles smaller parts
The Hybrid pick and place system can now handle 0201 components.
News from Dima SMT Systems NL, Apr 20, 2006
Automatic crimping machine proves popular
Contax has installed a second Komax Gamma 333PC automatic crimping machine at Elite Electronics, Northern Ireland's leading contract electronics manufacturer.
News from Contax, Apr 19, 2006
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