PCB Assembly Equipment, Tools
(a sub category of Electronics Manufacturing, Production, Packaging)
Latest articles from 'PCB Assembly Equipment, Tools'
News releases from this sub-category
Showing 651-675 of 1082 articles
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Licence provides second source for stencils
DEK has licensed its VectorGuard stencil technology to Christian Koenen of Munich, Germany.
News from DEK, Aug 4, 2004
Pair to refine novel filling process
Rohm and Haas Electronic Materials and Novatec have signed an exclusive licensing agreement to make and sell an innovative filling process and device.
News from Novatec, Aug 3, 2004
Reflow ovens break new ground
A new generation of Quattro Peak ovens for medium through very high volume applications includes many novel features, which until now have not been available in a reflow oven.
News from Inseto, Jul 30, 2004
Chicago showing for top-speed platform
Universal Instruments will show off its fastest platform based placement machine at ATExpo in Chicago this September.
News from Universal Instruments Corp, Jul 28, 2004
Mass imaging platform runs backside wafer coating
A new high throughput backside wafer coating process is capable of exceeding the +/-12.5mm total thickness variation stipulated by most wafer processing specialists.
News from DEK, Jul 27, 2004
Business booms in fume extraction
To increase sales and offer more support for growing markets, Purex International, manufacturer of laser and solder fume extraction systems has recruited additional staff.
News from Purex International, Jul 27, 2004
deSouza takes the helm
Universal Instruments Corp has announced a change at the top of its management structure.
News from Universal Instruments Corp, Jul 27, 2004
New agreement reinforces partnership
Yamaha IM and Assembleon have renewed their co-operation contract which perpetuates a 17-year partnership in the global SMD placement market.
News from Assembléon, Jul 22, 2004
New line aims for zero-defect production
Contax has been chosen by a leader in the manufacture of automotive assemblies to develop and install automated assembly lines for its next generation electronic power assisted steering systems.
News from Contax, Jul 21, 2004
Distributor reigns in Spain
Universal Instruments has appointed Madrid-based Asflex Internacional to support its sales operations in Spain.
News from Universal Instruments Corp, Jul 21, 2004
Quick start for high-power UV curing head
A new 70mm high power UV curing head is suitable for adhesive, inkjet and small print UV cure applications.
News from Jenton International, Jul 19, 2004
Tooling system provides firm support
Transition Automation's Board-Lok dedicated tooling systems are designed for double-sided printing, providing firm support customised for any board design.
News from Transition Automation, Jul 16, 2004
Quad-beam system speeds high-volume placement
Universal Instruments is bolstering its high-speed chip placement offering with the introduction of the Quadris placement machine.
News from Universal Instruments Corp, Jul 16, 2004
3D laser scanner checks paste and placement
The GSI Lumonics SVST 8300 SPI automated optical inspection system is optimised for high-throughput pre- and post-solder paste inspection of PCB assemblies.
News from Alliance Sales (Europe), Jul 15, 2004
Printers provide traceability for CD-Rs
With a production cycle of just 1.8s per CD-R, Europa Magnetics at Cramlington, Northumberland, is one of the most efficient disk manufacturing plants in Europe.
News from Imaje UK, Jul 15, 2004
Maia heads up new Brazilian operation
Universal Instruments has opened a direct sales and support office in Brazil to increase support for its growing customer base in the region.
News from Universal Instruments Corp, Jul 14, 2004
Novel pump design cuts solder paste waste
The new MPM MaxiMiser pump is billed as providing significant materials savings while reducing the downtime associated with product changeover.
News from Contax, Jul 13, 2004
Budget pricing for manual pick and place system
The Dima Fineline FP-700 is a manual pick and place system with integrated dispense unit and a hot air pencil that can handle boards to 280 x 220mm and components to 25 x 25mm.
News from Kaisertech, Jul 8, 2004
Ion nozzle provides static-safe cleaning
A new flexible ion nozzle is designed for repetitive cleaning tasks in a wide range of applications.
News from TBA Electro Conductive Products, Jul 7, 2004
Wafer feeder gains multiple-part flexibility
Universal Instruments has added an online wafer expander option to its wafer feeder system for advanced semiconductor assembly.
News from Universal Instruments Corp, Jul 7, 2004
New distributor has Ireland covered
DEK has signed a new distribution agreement it says will enhance service and support for its Irish customers.
News from DEK, Jul 6, 2004
Lightning platform to strike in Singapore
Universal Instruments will show its fastest platform based placement machine at Globaltronics in September in Singapore.
News from Universal Instruments Corp, Jul 5, 2004
More flexibility for low-end placement machines
Important new features further enhance the flexibility of Assembleon's proven Gem range of entry-level to medium-volume pick-and-place machines.
News from Assembléon, Jul 2, 2004
On Board signs for latest placement system
Surface mount equipment supplier VSMT has sold its first high-performance QPlacer HS 4000 component placement system.
News from VSMT, Jun 30, 2004
Fusion splicer helps network theme park
Drayton Manor Theme Park is the latest customer to be convinced by the award winning Fase II fusion splicer.
News from Tritec Developments, Jun 29, 2004
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