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PCB Assembly Equipment, Tools

(a sub category of Electronics Manufacturing, Production, Packaging)

Latest articles from 'PCB Assembly Equipment, Tools'

News releases from this sub-category

Showing 276-300 of 1082 articles

Package permits ultrathin coatings

A next-generation equipment and tooling package enables the coating of wafers with ultrathin die attach materials down to 25 microns in thickness.

News from DEK, Aug 3, 2006

Packages tailor soldering kit to users' needs

Soldering/desoldering equipment packages claim new standards for flexibility, capability, reliability and value in high-performance rework equipment.

News from OK International, Aug 2, 2006

Universal Instruments signs co-operation agreement

Universal Instruments and Tsinghua University have signed a co-operation agreement, officially sealing their commitment to promoting the development of education and training in China's SMT sector.

News from Universal Instruments Corp, Jul 31, 2006

Universal instruments leaves Dover portfolio

Universal Instruments Corporation announces that it is leaving the portfolio of technology businesses held by its current parent company, Dover Corporation, by mutual agreement

News from Universal Instruments Corp, Jul 28, 2006

First 3rd generation laser coders

The first 3rd generation of laser coders has been launched by Imaje, world leader in coding and marking solutions.

News from Imaje UK, Jul 27, 2006

High Throughput Singulated Substrate Processing

DEK has developed a mass imaging solution that delivers higher throughput, amazing levels of accuracy and streamlined, flexible processing capability.

News from DEK, Jul 27, 2006

Automated manufacturing for medical device makers

Contax Production Automation will exhibit a full range of automation solutions for medium volume manufacturers at Medtec Ireland.

News from Contax, Jul 24, 2006

Component placement cell chosen by Editors

Palomar Technologies has received an Editors' Choice Best Product Award for its Model 3500-II automatic component placement cell.

News from Palomar Technologies, Jul 24, 2006

Platform tops flip-chip machine poll

Universal Instruments' commitment to technical excellence was recognised during the Advanced Packaging Awards held at this year's Semicon West.

News from Universal Instruments Corp, Jul 21, 2006

Awards double for DEK at Semicon West

DEK took to the podium at last week's Semicon West event to accept not one, but two Advanced Packaging awards in recognition of the company's latest technology innovations.

News from DEK, Jul 19, 2006

Fluxer offers high-speed alternative for PoP

Hardware and process technology accommodates effective flux dipping and soldering for enhanced manufacturing flexibility in package-on-package applications.

News from Universal Instruments Corp, Jul 19, 2006

Battery-actuated hydraulic crimper delivers more

The newly designed Burndy Patriot PAT750XT-18V battery-actuated hydraulic crimping tool is designed for the contractor, utility and telecommunications markets.

News from FCI-Burndy, Jul 19, 2006

Acquisition adds AOI to placement portfolio

Siemens Automation and Drives has acquired Opto-Control Elektronik Prufsysteme of Bochum, Germany.

News from Siemens Automation and Drives EAS, Jul 17, 2006

Unrivalled customer support gets the green light

DEK has launched a new Health Check facility for its ISCAN (Intelligent Scaleable Control Area Network) architecture.

News from DEK, Jul 14, 2006

Improved homepage eases website navigation

Homepage enhances the visual and ergonomic appeal of a comprehensive online knowledge base to facilitate easier access to the wealth of industry, product, process and support information within.

News from DEK, Jul 11, 2006

Soldering systems upgrade to lead-free manufacture

Cost-effective enhancements are available for Metcal MX-500 and SP200 soldering systems that optimise them for lead-free manufacture.

News from OK International, Jul 5, 2006

Manual stencil printer needs no power

A benchtop manual stencil printer is the latest designed for low- to medium-volume surface-mount assembly runs.

News from Dima SMT Systems NL, Jul 3, 2006

Chip placement platforms add software bonus

Universal Instruments is to include NPI software installed and activated free of charge with all future orders for its Genesis high-speed chip placement platforms.

News from Universal Instruments Corp, Jun 28, 2006

Wave soldering system suits lead-free tasks

The Speedline Electrovert VectraElite wave soldering system is now available exclusively from Contax in the UK, Benelux and Ireland.

News from Contax, Jun 28, 2006

UK source for German assembly cells

Gateway Design has signed an exclusive UK agency deal with ACI-ecotec, a newly formed German company specialising in robotic cells for electronics assembly.

News from Gateway Design, Jun 26, 2006

Placement pick futureproofs surface mount line

In 2005 MJP Electronics reached a turning point in its business development, and needed to make some important decisions on updating its surface mount placement capability.

News from Blundell Production Equipment, Jun 23, 2006

Supplier award completes the chain

FCI-USA has been named 2005 Supplier of the Year by Border States Supply Chain Solutions.

News from FCI-Burndy, Jun 13, 2006

Soldering system evolves for Pb-free challenge

Two new upgrades from OK International put its successful PS-800 hand soldering system at the forefront in lead-free hand soldering.

News from OK International, Jun 8, 2006

Inkjet printers to raise OLED resolution

CDT and Litrex are paving the way for the production of a new generation of high-resolution P-OLEDs through the development of an inkjet printing solution capable of 200pixel/in printing.

News from Cambridge Display Technology, Jun 7, 2006

Inkjet printer to advance university OLED work

Cambridge Display Technology has sold an inkjet printing system and associated knowhow to the National University of Singapore.

News from Cambridge Display Technology, Jun 7, 2006

Showing 276-300 of 1082 articles

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