PCB Assembly Equipment, Tools
(a sub category of Electronics Manufacturing, Production, Packaging)
Latest articles from 'PCB Assembly Equipment, Tools'
News releases from this sub-category
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Printer tooling system cuts size and cost
The new Grid-Lok tooling system extends the choices available to customers sourcing tooling for DEK printer platforms.
News from DEK, Sep 1, 2005
Offline programming station speeds throughput
A new offline programming station speeds throughput for small batch users of Dima Hybrid pick and place systems.
News from Dima SMT Systems NL, Aug 30, 2005
Platform shifts to system-in-package assembly
The AdVantis XS is the latest Platform placement system from Universal Instruments.
News from Universal Instruments Corp, Aug 29, 2005
Munich launch for nonstick squeegee holder
Transition Automation will be showcasing a new squeegee holder at Productronica that promises to reduce a common problem which occurs during solder paste printing.
News from Transition Automation, Aug 29, 2005
German equipment finds new Gateway to UK market
Gateway Design has recently signed an exclusive representative agreement with the German automated equipment manufacturer ACI-ecotec.
News from Gateway Design, Aug 25, 2005
Tooling speeds automotive press-fit operations
A new machine system is designed to deliver increased levels of quality, cost-effectiveness and productivity installing press-fit connectors in automotive applications.
News from Tyco Electronics - Global Application Tooling, Aug 24, 2005
Toolkit has universal appeal
A new universal service and maintenance toolkit is ideal for low volume production, prototyping and repair.
News from Tyco Electronics - Global Application Tooling, Aug 24, 2005
Heat-seal systems put LCDs in place
A-Tec heat-seal systems provide a versatile and reliable production method for joining LCDs to flex circuits and LCDs to PCBs for mobile phones, automobiles and other consumer product applications.
News from Acal TC, Aug 23, 2005
Mass imaging turns to IC thermal management
DEK has successfully applied its mass imaging techniques to improve the uniformity of thermal interface material deposited between a silicon die and its package lid.
News from DEK, Aug 19, 2005
Schmits takes over presidency
Dover Technologies has appointed Jeroen Schmits as President of Universal Instruments Corp.
News from Universal Instruments Corp, Aug 16, 2005
Mass imaging solutions on show in Munich
Between 15th and 18th November, Productronica 2005 will witness DEK presenting an impressive range of industry-leading high accuracy mass imaging solutions from Hall A4, Booth 305.
News from DEK, Aug 15, 2005
New office brings fresh air to the Americas
Purex International, manufacturer of fume extraction systems for soldering, lasers, laboratories, welding and other applications, opens the doors of Purex Americas for business this week.
News from Purex International, Aug 12, 2005
Crimping tool addresses "big three" criteria
At its core, the process of crimping electrical connectors is not complicated: however, the same cannot be said about the process of choosing a crimping tool, says Robert Poirier.
News from FCI-Burndy, Aug 12, 2005
Handheld printer is flexible about identification
The T107M printer is a heavy-duty tool that combines an affordable, easy to use, ruggedised handheld thermal transfer printer with labels and heat shrink tubing developed for tough applications.
News from Tyco Electronics UK, Aug 11, 2005
Brochure available
Advanced line speeds through flip-chip assembly
Universal Instruments has designed an advanced assembly line that can assemble over 2000 flip chips per hour on flexible circuits.
News from Universal Instruments Corp, Aug 11, 2005
Assembly cells to the fore at ATExpo
Universal Instruments will highlight its Polaris and Polaris Junior assembly cells at ATExpo 2005.
News from Universal Instruments Corp, Aug 10, 2005
Kit offers quick route to fibre termination
The Xpress termination kit offers fast and reliable LC, SC and ST connector terminations for optical local area networks.
News from Molex UK, Aug 10, 2005
New boss for Asia Pacific organisation
Assembleon Asia Pacific has appointed Goh Kee Tuan as Vice President/General Manager.
News from Assembléon, Aug 8, 2005
Italian distributor expands portfolio
Universal Instruments and Selettra have extended their distribution partnership in the Italian electronics market.
News from Universal Instruments Corp, Aug 8, 2005
Award for precision coating system
At the Semicon West Show in July Ultrasonic Systems was awarded the SST Attendees' Choice Award for "Best cost of ownership".
News from Ultrasonic Systems, Aug 2, 2005
Imaging platform turns to backside wafer coating
Long recognized as the world leader in high accuracy mass imaging technology, DEK has led the way with yet another cost-effective packaging solution.
News from DEK, Aug 1, 2005
Precise coating application on show in Chicago
Ultrasonic Systems will display the Prism Ultra-Coat System at the Assembly Technology Expo from 27th to 29th September 2005 in Chicago.
News from Ultrasonic Systems, Jul 26, 2005
Die handling system cuts production bottleneck
A novel fully automated handling system picks die from diced 300mm wafers and transfers them to die carriers, such as waffle packs, GelPaks etc.
News from Royce Instruments, Jul 25, 2005
Mass imaging platform scoops magazine award
In a ceremony at last week's Semicon West exhibition in San Francisco, California, DEK's Galaxy high accuracy mass imaging platform collected Advanced Packaging magazine's prestigious AP Award.
News from DEK, Jul 21, 2005
Kan spearheads Asian expansion
Universal Instruments Corp has appointed Eric Kan to the position of Vice President for Asia, enhancing the company's commitment to this major growth area.
News from Universal Instruments Corp, Jul 20, 2005
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