Product category: Electronics Manufacturing Machinery and Materials
News Release from: DEK | Subject: DirEKt Ball Attach
Edited by the Electronicstalk Editorial Team on 19 November 2002
Mass imaging technology
handles 300mm wafers
DEK has successfully deployed a production wafer bumping solution for 300mm wafers at customer sites in Asia
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The system has been developed using DEK's mass imaging technology for back end wafer processing and wafer handling technology developed by Adept Semiconductor Handling Division of Livermore, California in conjunction with DEK The new system builds on DEK's existing back end solutions for 150 and 200mm wafers, and is capable of transferring 300mm wafers from open cassettes or FOUP's into the processing station, and of automatically returning them to the cassette or FOUP or directly to reflow oven when processing is complete.
Wafers are transported by a conveyor, which is integrated with the system via standard, SMEMA-compliant interfaces.
"This is a real, production system that is in action today, processing our customer's 300mm wafers and delivering excellent results", said Neil MacRaild, Manager of DEK's Semiconductor Packaging Technologies Group.
"This is important news as commercial electronic manufacturers move toward volume production of high performance chip scale packages".
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DEK's back end processing solutions for 150 and 200mm wafers are already in operation at customer sites throughout Europe, the USA and Asia.
These successful processes, including DirEKt Ball Attach solder ball placement, and fine-pitch bumping by paste deposition, are based on DEK's patented ProFlow DirEKt Imaging technology that enables precision control of electronic materials for deposition onto wafers and other substrates such as FR4 epoxy.
These include solder balls down to 0.3mm, solder pastes including low-alpha pastes, encapsulants and other materials required by advanced semiconductor packaging.
By reducing the capital cost of clean room space of back end wafer level processes, while enhancing equipment flexibility and first pass yield, DEK's packaging technologies allow advanced wafer level CSPs and other chip scale package styles to be applied to a wide range of commercial component types.
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