Product category: Electronics Manufacturing Machinery and Materials
News Release from: DEK | Subject: Galaxy
Edited by the Electronicstalk Editorial Team on 21 July 2005
Mass imaging platform
scoops magazine award
In a ceremony at last week's Semicon West exhibition in San Francisco, California, DEK's Galaxy high accuracy mass imaging platform collected Advanced Packaging magazine's prestigious AP Award
The win again confirms DEK's next-generation packaging leadership and the high accuracy processing capabilities of the Galaxy platform. DEK's unique Galaxy system combines several new technologies that enable high accuracy mass imaging for a variety of final manufacturing packaging applications, from wafer-level up to and including encapsulation and solder ball attach.
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Galaxy addresses the ever present need for resource maximisation, as it can be configured and easily redeployed to host a number of different packaging processes including wafer bumping, ball placement, singulation, thermal interface material (TIM) deposition and backside wafer coating.
The system is compatible with industry-standard handling formats such as FOUPS or Auer boards, plus wafer chucks and DEK's virtual panel tooling (VPT).
'The tremendous benefits of high accuracy mass imaging for semiconductor packaging applications have definitely been proven', says Richard Heimsch, President of DEK International.
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DEK has will exhibit alongside local representative SMA in booth # L70/M71 at the upcoming Electronica Brazil show
'It's very gratifying to have the advantages of the Micron-class Galaxy platform again recognised and honoured with its win of the prestigious AP Award'.
To achieve wafer-level accuracy and repeatability, Galaxy combines the latest linear motors and absolute position encoders with DEK's proven chassis and ProFlow enclosed transfer head technologies.
The system boasts process capability (Cpk) of 2.0 at +/-12.5um and a 7s cycle time - regardless of process or number of deposits.
Galaxy is also equipped with DEK's Instinctiv user interface, allowing for minimal training and simplified operation.
onboard Internet technologies enable remote diagnostics and process support, to maximise uptime and minimise repair overheads.
'Galaxy's inherent accuracy, repeatability, flexibility and industry-leading cycle time are changing the way semiconductor specialists think about alternatives to traditional packaging processes', concludes Heimsch.
'DEK's innovative systems are leading the way for next-generation, cost-effective packaging applications'.
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