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Product category: PCB Assembly Equipment and Tools
News Release from: DEK | Subject: Backside wafer coating process
Edited by the Electronicstalk Editorial Team on 01 August 2005
Imaging platform turns to backside wafer
coating
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Long recognized as the world leader in high accuracy mass imaging technology, DEK has led the way with yet another cost-effective packaging solution.
DEK has developed a high-throughput backside wafer coating process, hosted on a mass imaging platform and capable of exceeding the +/-12.5um total thickness variation (TTV) required by most wafer processing specialists The company's new process is compatible with underfill or adhesive-type coatings which are normally applied at a nominal 50um thickness to the backside of semiconductor wafers prior to singulation