Product category: Electronics Manufacturing Machinery and Materials
News Release from: DEK | Subject: TIM solution
Edited by the Electronicstalk Editorial Team on 19 August 2005
Mass imaging turns
to IC thermal management
DEK has successfully applied its mass imaging techniques to improve the uniformity of thermal interface material deposited between a silicon die and its package lid
DEK has successfully applied its mass imaging techniques to improve the uniformity of thermal interface material (TIM) deposited between a silicon die and its package lid during semiconductor packaging processes. By using DEK's ProFlow Direkt imaging technology to mass image the TIM, semiconductor manufacturers now have assurance that the material thickness is uniform across the entire die surface.
This article was originally published on Electronicstalk on 19 August 2005 at 8.00am (UK)
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Advantages include better thermal conductivity between the die and the lid, which improves reliability and delivers greater lid coplanarity.
'Mass imaging is significantly more controllable and repeatable than traditional dispensing when depositing TIM', says Richard Heimsch, President of DEK International.
'Additionally, DEK's process makes it easier to verify uniform spreading and absence of voids before the package lid is assembled'.
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'This latest semiconductor manufacturing solution further confirms the versatility and value of mass imaging to the packaging industry'.
During the DEK TIM process, die that have been assembled onto substrates enter a flexible printing system that combines three processes - passive attach, TIM and lid sealing - into a single platform.
The use of one printing system gives the customer the flexibility to redeploy equipment between processes to meet changes in manufacturing requirements and allows efficient single-platform operator training.
compared with traditional, serial dispensing, the parallel mass imaging process increases true throughput and delivers greater control over the volume of material deposited.
This technique also allows the shape of the TIM deposit to be more accurately controlled, repeatable and uniform across the surface of the die.
Because the process does not require the TIM to be spread via lid placement, defects such as material voids or incomplete spreading are eliminated.
This is an extremely important benefit to semiconductor manufacturers and packaging specialists, as these flaws are extremely difficult to inspect once lid placement has occurred.
'As devices continue to get smaller and smaller, heat dissipation via the effective application of TIMs is more critical than ever', concludes Heimsch.
'DEK's TIM solution is just one of the many ways in which mass imaging is responding to the ever-changing requirements of the semiconductor packaging market'.
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