Latest news on Electronicstalk categorised by product type

IC and Hybrid Processing Equipment

Archive page 8 of 9

Our RSS feed for IC and Hybrid Processing Equipment press releases

Alliance focuses on integrated fab solutions

Focused on the continuing demand from semiconductor equipment and chip manufacturers for turnkey connectivity solutions, Asyst Technologies and The Peer Group have formed a strategic alliance.

News from Peer Group (24 July 2003)

National signs up for wire bonders

National Semiconductor has signed a volume purchase agreement (VPA) for the purchase of Maxum wire bonders.

News from Kulicke and Soffa Industries (15 July 2003)

Wire bonders bound for China

Kulicke and Soffa Industries has received a purchase order from Nantong Fujitsu Microelectronics for an additional 50 Nu-Tek ball bonders.

News from Kulicke and Soffa Industries ( 9 July 2003)

Improvement brings award from Intel

Disco Corp has been named a recipient of Intel Corp's prestigious 2002 Supplier Continuous Quality Improvement award, Intel's highest honour for its suppliers.

News from Disco Hi-Tec (13 May 2003)

Pair collaborate on copper and low-k integration

Keithley Instruments is working with Novellus Systems to develop electrical process diagnostic tes