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IC and Hybrid Processing Equipment
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Name change follows Leica acquisition
Vistec Semiconductor is the new name for Leica Microsystems Semiconductor Equipment Division.
News from Vistec Semiconductor Systems (10 April 2006)
E-beam system prepares for 32nm technology
A high-performance variable shaped electron beam system enables direct patterning for the 32nm technology node for R and D and prototyping.
News from Vistec Electron Beam (10 April 2006)
Budget e-beam system enables a quick turn
A universal cost-effective e-beam system for both direct write and mask making applications enables users to react flexibly to market demands.
News from Vistec Electron Beam (10 April 2006)
SEZ Group chooses interface software
SEZ Group has chosen CIMPortal to facilitate high speed data collection and routing for creating Interface A solutions for its semiconductor equipment.
News from Cimetrix ( 7 April 2006)
MEMS foundry orders first cluster tool
Surface Technology Systems has received its first order for a VPX cluster tool with a Pegasus deep reactive ion etch (DRIE) process module, from Dalsa Semiconductor.