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IC and Hybrid Processing Equipment
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Wafer scribe takes on delicate dice
The Scribe 100-3 is another machine from PESL developed for the new generation of delicate die wafers.
News from Production Equipment Sales (12 August 2002)
Wafer feeder puts dice onboard
Assembleon has a new wafer feeder option for its Topaz-XiII and ACM component placement machines.
News from Assembléon (10 June 2002)
Wafers clean up without stopping the show
Nitto Denko has developed the world's first cleaning wafer that removes waste from wafer prober absorption tables without having to shut down the testing process.
News from Nitto Denko Corp (21 May 2002)
Preforms seal glass to metal for packaging
Good news for laser diode packaging comes from Production Equipment Sales (PESL) in the shape of the Diemat range of glass preforms for use in hermetically sealing glass to metal.
News from Production Equipment Sales (16 April 2002)
Datacon goes direct in USA and Asia
Datacon Technology is reorganising its international operations with direct subsidiaries in the USA and Asia.