Latest news on Electronicstalk categorised by product type

IC and Hybrid Processing Equipment

Archive page 2 of 9

Our RSS feed for IC and Hybrid Processing Equipment press releases

Boulanger takes charge of die bonder operations

Kulicke and Soffa Industries has appointed Richard Boulanger as General Manager of its die bonder operations located in Berg, Switzerland.

News from Kulicke and Soffa Industries (20 November 2006)

Power amplifier package survives Martian duties

 User application article   One of StratEdge's SE20 power amplifier packages is playing a key role in transmitting signals with information gathered from Mars Exploration Rovers Spirit and Opportunity back to earth.

News from StratEdge (17 November 2006)

Arsenic source speeds MBE growth

The new ECellAs valved arsenic effusion source or "cracker cell" for molecular beam epitaxy is designed for high performance MBE growth of arsenic-containing III-V materials.

News from Oxford Instruments Plasma Technology (13 November 2006)

Micromachining system advances Welsh centre

Oxford Lasers has recently installed the most advanced ultrafast micromachining system of its kind at the Manufacturing Engineering Centre (MEC), Cardiff.

News from Oxford Lasers ( 8 November 2006)

Direct writing technology proved in F1 application

Scientists and engineers from BAE Systems' Advanced Technology Centre in Filton, UK, have developed technology to "write" electrical circuit