Latest news on Electronicstalk categorised by product type
IC and Hybrid Processing Equipment
Archive page 7 of 9
Our RSS feed for IC and Hybrid Processing Equipment press releases
Ball bonders engineered for higher productivity
Kulicke and Soffa Industries has added two new automatic ball bonders to its highly successful Maxum series platform, which already boasts more than 8000 units installed worldwide.
News from Kulicke and Soffa Industries (17 March 2005)
Wedge bonder technology sold off
Kulicke and Soffa Industries has sold its wedge bonder technology to Orthodyne Electronics in Irvine, California.
News from Kulicke and Soffa Industries (17 March 2005)
Cimetrix wins a dozen new customers
Despite a generally sluggish market in the semiconductor equipment business sector, Cimetrix managed to meet its target to gain 12 new major OEM customers for the year 2004.
News from Cimetrix (17 January 2005)
Two new VPs for Cimetrix
After posting three consecutive quarters of profit and on track for a profitable 2004, Cimetrix is strengthening its executive team and realigning two key departments to support growth in 2005.
News from Cimetrix ( 7 January 2005)
More control for wafer polishing
Engis has launched its new SM lapping machine to provide increased productivity to a wider group of users.