Click on the advert above to visit the company web site
Product category: IC and Hybrid Processing Equipment
News Release from: Kulicke and Soffa Industries | Subject: IConnPS and ConnXPS
Edited by the Electronicstalk Editorial Team on 18 March 2008
Wire bonders move to next generation
Request your FREE weekly copy of the Electronicstalk email newsletter. News about IC and Hybrid Processing Equipment and more every issue. Click here for details.
Series offers higher accuracy over a larger bondable area, and represents the most technologically advanced assembly equipment in the market.
Kulicke and Soffa Industries has released two next-generation wire bonders at Semicon China, in Shanghai The first is the new IConnPS high performance wire bonder, which will replace the current market-leading Maxumultra
This article was originally published on Electronicstalk