Intellectual Property Cores
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Latest articles from 'Intellectual Property Cores'
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Graphics processor units for multimedia apps
ARM has announced availability of two ARM Mali graphics processor units (GPUs) for mobile multimedia applications at the 3GSM World Congress in Barcelona, Spain.
News from ARM, Feb 14, 2007
Renesas licenses ARM processor
ARM has announced that Renesas Technology has licensed the high-performance, low-power ARM1176JZF-S processor for the development of advanced mobile/consumer electronics applications.
News from ARM, Feb 14, 2007
Processor core powers TI's HD platform
ARM has welcomed the outstanding capabilities of the Texas Instruments OMAP3430 processor, integrating the ARM Cortex-A8 processor.
News from ARM, Feb 14, 2007
Verification IP validates RAID interfaces
LSI verification engineers depend on Denali's interoperable and high-quality verification solutions to deploy their PCI Express technology.
News from Denali Software, Feb 14, 2007
Low power signalling boasts big bandwidth
Rambus has unveiled low power signalling technologies targeted at multigigabit-per-second platforms at the International Solid State Circuits Conference in San Francisco.
News from Rambus, Feb 14, 2007
DSP core to drive UMTS baseband processor
Cellular3G will integrate the high-performance Ceva-X1620 DSP into a new UMTS baseband processor targeting high-end mobile phone applications.
News from Ceva, Feb 13, 2007
Imaging sensor takes processor onbaord
MagnaChip has integrated the HiveFlex ISP 2200 processor into a new imaging sensor, the MC531EA.
News from Silicon Hive, Feb 13, 2007
Video cores for mobile devices
New from Imagination Technologies at 3GSM 2007 in Barcelona are the PowerVR VXE 250 and PowerVR VXD 330 video cores for mobile devices.
News from Imagination Technologies, Feb 13, 2007
Mobile multimedia technologies on show at 3GSM
VGisitors to the Imagination Technologies stand at 3GSM 2007 can see graphics and video technologies being adopted by manufacturers now for the next generation of mobile multimedia.
News from Imagination Technologies, Feb 13, 2007
Software developers join in 3GSM demos
The latest advancements in content for mobile gaming, UI, entertainment and navigation in the next generation of mobile multimedia can be seen at 3GSM 2007.
News from Imagination Technologies, Feb 13, 2007
Mobile TV platform supports Japanese standard
Imagination Technologies has extended the support of its multistandard mobile TV receiver platform to include the Japanese One Seg mobile TV standard.
News from Imagination Technologies, Feb 13, 2007
Baseband core helps Infomax hit handset targets
Taiwan-based semiconductor vendor Infomax has completed its next generation of cellular handset chips using baseband silicon IP from Comsys.
News from Comsys Communication and Signal Processing, Feb 13, 2007
Programme promises early start on WiMAX handsets
Comsys is launching an early engagement programme for key customers of its ComMAX CM1100 and CM1125 processors the 3GSM World Congress.
News from Comsys Communication and Signal Processing, Feb 13, 2007
Quad-MAC DSP core to power WiMAX baseband
Comsys has licensed the Ceva-X1641 quad-MAC DSP core for its latest generation of WiMAX baseband processors.
News from Comsys Communication and Signal Processing, Feb 13, 2007
Tensilica audio/video processors at 3GSM Congress
Tensilica will be showcasing mobile phones that use its audio and video processors at the 3GSM World Congress (Hall 2, Level 1, Booth 2.1A67) in Barcelona, Spain, February 12-15, 2007.
News from Tensilica, Feb 9, 2007
Audio engine adds 3D enhancements
AM3D's Zirene audio enhancement and Diesel Power Mobile 3D audio products are now available for Tensilica's HiFi 2 Audio Engine and Diamond Standard 330HiFi processor core.
News from Tensilica, Feb 8, 2007
IP programme eases design resource access
Programme enables centralised access to information about intellectual property portfolios of industry-leading IP providers.
News from Chip Estimate Corp, Feb 8, 2007
PCI Express core works compliantly with NXP PHY
The Databahn PCI Express (PCIe) IP core and NXP PCIe PHY PX1011A provide customers a silicon-proven PCIe solution which is version 1.1 specification compliant.
News from Denali Software, Feb 8, 2007
Programme eases Flash device integration
Spansion has joined the Denali Software Memory Vendor Programme, providing chip designers with high-quality simulation models to efficiently deploy Spansion Flash devices into all electronic designs.
News from Denali Software, Feb 6, 2007
TSMC signs up for 1T-SRAM technology
MoSys has licensed Taiwan Semiconductor Manufacturing Company to develop and market memory macro products using its patented 1T-SRAM high-density embedded memory intellectual property.
News from MoSys, Feb 6, 2007
Wintegra signs up for memory BIST
Wintegra has selected LogicVision's leading-edge memory BIST solution, ETMemory, to help it meet its silicon manufacturing quality goals.
News from LogicVision Europe, Feb 6, 2007
Seminars explain SoC memory designs
Technical seminars address techniques for designing today's DDR2 SDRAMs into SoC applications, and the future for DDR3 memories.
News from Mosaid, Feb 2, 2007
Faraday expands commitment to ARM-based CPUs
Faraday Technology has licensed the ARM926EJ-S microprocessor and the ARMv5TEJ instruction set for its next-generation FA CPU family for embedded, networking and multimedia applications.
News from Faraday Technology, Feb 2, 2007
Physical layer IP helps put compliant PCIe on SoCs
High-performance PCI-SIG-compliant solution can reduce costs and accelerate the development of PCI Express technology based SoCs.
News from ARM, Feb 2, 2007
Configurable processor answers all Marvell's needs
Marvell plans to use the Xtensa LX2 configurable processor in various products throughout the company.
News from Tensilica, Feb 2, 2007
Showing 376-400 of 1567 articles
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Featured articles
- LSI adds processor core and memory blocks to range
LSI has announced the addition of the multicore-capable PowerPC 476 microprocessor core and high-speed, embedded DRAM memory blocks to its portfolio of custom silicon intellectual property (IP).
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