Communications ICs (Wired)
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Chipsets carve out four different mobile segments
Four new GSM/GPRS chipset solutions build on the market success of their predecessors to enable compelling new multimedia applications on wireless mobile devices addressing all market segments.
News from Texas Instruments, Feb 24, 2003
Elcoteq joins Innovative Convergence fan club
Elcoteq, Europe's largest electronic manufacturing services company, is the 12th company to adopt Motorola's Innovative Convergence platforms.
News from Freescale Semiconductor, Feb 21, 2003
Nokia and TI extend development work
Nokia and Texas Instruments have extended their relationship through an agreement on Nokia's Series 60 Platform and Texas Instruments' industry-leading OMAP application processors.
News from Texas Instruments, Feb 21, 2003
3G trio powered by OMAP processors
All three new FOMA (freedom of multimedia access) 3G handset models from NTT DoCoMo will feature TI's high-performance, power-efficient OMAP application processors.
News from Texas Instruments, Feb 21, 2003
Multimedia baseband hosts cellular system solution
The Nexperia cellular system solution is based on Philips' successful Nexperia multimedia baseband, and is designed to enable manufacturers to deliver affordable multimedia handsets to end users.
News from Philips Semiconductors, Feb 19, 2003
Network Associates to add security to OMAP
Network Associates and Texas Instruments are to work together to provide a wireless security solution for OMAP application processors targeting 2.5G and 3G wireless handsets and other mobile devices.
News from Texas Instruments, Feb 19, 2003
Mobile platform to gain 3D graphics capabilities
Criterion Software is working with Texas Instruments to integrate optimised solutions into its RenderWare Mobile client technology and toolchain.
News from Texas Instruments, Feb 18, 2003
Chipset cuts embedded Internet modem down to size
Leading European vendor of embedded modem solutions, COM One, has developed a low-cost low-power modem solution based on TI's TMS320C54V90 chipset.
News from Texas Instruments, Feb 17, 2003
Fierce stuff for wireless accord
The recently announced joint collaboration between Philips and General Atomics has been selected as a member of the 802.11 Report's annual list of "The Fiercest 15".
News from Philips Semiconductors, Feb 12, 2003
Interfaces simplify flexible switching designs
Integrated Device Technology has introduced the industry's first complete family of universal line interface units (ULIUs), including octal, quad, dual and single densities.
News from IDT, Feb 11, 2003
Synad expands on three continents
Synad has begun an international expansion programme with new offices in Asia, Europe and the USA.
News from Synad Technologies, Feb 11, 2003
Cable modem chip supports new specs
Vendors designing DOCSIS 2.0-based cable modems can now leverage the same platform from Texas Instruments that was successful in Certification Wave 24 DOCSIS 2.0 testing.
News from Texas Instruments, Feb 10, 2003
Software system on chip cuts 3G infrastructure
picoChip Designs has sampled its first device, the PC101, which delivers a massive computational power of 30GMACs per second.
News from picoChip Designs, Feb 5, 2003
Chipset provides complete 3G basestation baseband
A new programmable chipset enables cellular infrastructure manufacturers to create low-cost, differentiated channel cards for 3G basestations without the burden of developing their own custom ASICs.
News from Texas Instruments, Feb 5, 2003
Second generation FireWire goes further and faster
Consumer, computing and audio/video applications can now reach higher speeds and greater distances with the industry's first available 1394b (FireWire) devices from Texas Instruments.
News from Texas Instruments, Feb 5, 2003
Less power needed for quad transceiver
Fairchild Semiconductor has a new quad-channel transceiver that uses 25% less power than comparable devices across an operating range from 100Mbit/s to 1.36Gbit/s.
News from Fairchild Semiconductor, Feb 4, 2003
Zarlink aims to break even in 2004
Zarlink Semiconductor has released third quarter results for the fiscal 2003 period ended 27th December 2002.
News from Zarlink Semiconductor, Feb 3, 2003
Agilent praises excellent performance
Agilent Semiconductor has awarded pan-European distributor Future Electronics its "Performance Excellence Award" for new sales growth during 2002.
News from Future Electronics, Jan 31, 2003
Controllers speed migration to Gigabit Ethernet
New from TranSwitch is the Envoy family of versatile Ethernet controllers for next generation multiservice networks.
News from TranSwitch Europe, Jan 30, 2003
Mitchell takes charge at Arrow
The Board of Directors of Arrow Electronics has appointed William E Mitchell, 58, to the position of President and Chief Executive Officer, effective from the 3rd February 2003.
News from Arrow Electronics (UK), Jan 27, 2003
Transceiver cuts the cost of high-speed USB links
Cypress Semiconductor has released its EZ-USB TX2 transceiver (CY7C68000) for just $1.00 in volumes of 100,000 units.
News from Cypress Semiconductor, Jan 24, 2003
Joint venture eyes Chinese 3G market
Datang Mobile Communications Equipment Co, Royal Philips Electronics and Samsung Electronics have formed a joint venture company, named T3G.
News from Philips Semiconductors, Jan 22, 2003
Polidori moves up to European role
Pietro Polidori has been promoted to the position of European Sales Director at IDT.
News from IDT, Jan 20, 2003
Future takes Tundra to Europe
Tundra Semiconductor has signed a distribution agreement with Future Electronics which will use Future's design-in expertise to access key European customers.
News from Future Electronics, Jan 17, 2003
Support for standards-based Wi-Fi security
Intersil is to support the Wi-Fi Alliance's new standards-based solution for enhanced security called Wi-Fi Protected Access or WPA.
News from Intersil, Jan 16, 2003
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