Communications ICs (Wired)
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Rohm and Digiplug to work on multimedia
Rohm and Digiplug are to enter into a long-term partnership aiming at developing enhanced solutions for mobile multimedia applications.
News from Rohm Electronics (UK), Feb 15, 2002
Zarlink appoints Unique Memec in Switzerland
Zarlink Semiconductor has appointed Unique Memec as its value-added distributor in Switzerland.
News from Zarlink Semiconductor, Feb 14, 2002
Three PLLs in one for SONET synchronisation
Zarlink Semiconductor has the world's first commercial digital PLL chip that fully meets rigorous international standards for very high performance synchronisation in SONET/SDH systems.
News from Zarlink Semiconductor, Feb 14, 2002
Chip reduces number of routers in the metro
The PM5383 S/UNI-12xJET from PMC-Sierra is a complete physical layer solution for the aggregation, transport and termination of up to 12-channels of DS3/E3 and J2 protocols.
News from PMC-Sierra, Feb 14, 2002
Successful xDSM trials herald transceiver ASIC
Altra Broadband has successfully demonstrated a dense subcarrier multiplexing (xDSM) transceiver board for broadband networking.
News from Altra Broadband, Feb 11, 2002
Full family for faster USB designs
Dedicated NEC distributor Sunrise Electronics is releasing a new family of integrated circuits that speed USB designs into the next generation.
News from Sunrise Electronics, Feb 7, 2002
0.35-micron process rocket powers comms devices
Alcatel is offering Europractice customers worldwide access to its new high-speed 0.35-micron SiGe1 BiCMOS technology for prototyping and volume production.
News from Alcatel Microelectronics, Feb 1, 2002
Alcatel take licence to boost DSL chipsets
Alcatel has licensed ReachDSL from Paradyne Networks for its microelectronics unit to jointly develop and produce a new generation of ADSL chipsets.
News from Alcatel Microelectronics, Feb 1, 2002
Switched Fabric Interface to gain acceptance
The Switched Fabric Interface is set to move into mainstream technology, according to WT Greer Jr, Fairchild Semiconductor's senior VP and general manager of the Interface and Logic Group.
News from Fairchild Semiconductor, Feb 1, 2002
Enhanced messaging added to OMAP platform
Comverse's world leading enhanced messaging services will now operate on TI's high-performance and power-efficient OMAP platform for 2.5G and 3G wireless devices.
News from Texas Instruments, Feb 1, 2002
PMC-Sierra and Alvesta solve 10 Gigabit Ethernet
PMC-Sierra and Alvesta have demonstrated 10 Gigabit Ethernet interoperability between PMC-Sierra's PM8355 QuadPHY-II SERDES device and Alvesta's 3200 optical transceiver.
News from PMC-Sierra, Jan 31, 2002
Bus repeaters improve signal integrity
Fairchild Semiconductor has expanded its LVDS interface IC portfolio with four new LVDS repeaters.
News from Fairchild Semiconductor, Jan 30, 2002
Accelerator chip speeds mobile Java performance
New from Nazomi Communications, the JA108 Java accelerator chip improves Java software execution while extending battery life in mobile wireless applications, such as 2G/2.5G/3G phones.
News from Nazomi Communications, Jan 30, 2002
LSI looks to HyperTransport Technology for I/O
LSI Logic has joined the HyperTransport Technology Consortium.
News from LSI Logic Europe, Jan 29, 2002
RadioScape acquires Systolix
RadioScape has acquired the business and assets of Systolix.
News from RadioScape, Jan 28, 2002
Bluetooth baseband passes the test
Alcatel's Bluetooth baseband chip, the MTC-60180, has received Bluetooth qualification.
News from Alcatel Microelectronics, Jan 25, 2002
Zarlink foundry sale points to design focus
Zarlink Semiconductor has signed a definitive agreement with Dalsa Corp to sell its foundry facility in Bromont, Quebec, and related business to Dalsa for CDN$27 million.
News from Zarlink Semiconductor, Jan 25, 2002
Alcatel expands in US "motor town"
Alcatel has expanded its sales, design and product application engineering office in Detroit.
News from Alcatel Microelectronics, Jan 23, 2002
Single chip ready for USB On-The-Go
New from Philips Semiconductors, the ISP1362 is a USB On-The-Go (OTG) chip that is fully compliant with the USB Implementers Forum's (IF) OTG Supplement to the USB 2.0 Specification.
News from Philips Semiconductors, Jan 23, 2002
First multipoint-LVDS data line circuits
A new family of low-power, low-noise solutions for high-speed backplane and cable transmission of multipoint data is now available from Texas Instruments.
News from Texas Instruments, Jan 23, 2002
GPRS chipset gains Java
Kada Systems and Texas Instruments are to integrate the Kada Mobile Platform with TI's TCS2100 GPRS chipset.
News from Texas Instruments, Jan 18, 2002
Philips adds ASIC skills to Flarion programme
Philips Semiconductors has joined with leading wireless infrastructure companies to support Flarion Technologies' flash-OFDM alliance programme.
News from Philips Semiconductors, Jan 17, 2002
Pair to boost messaging content
Bluefish Technologies has signed a development agreement with VIPMobile to jointly deliver a revolutionary new SIM-enabled application to existing mobile handsets.
News from Bluefish Technologies, Jan 15, 2002
Frugal DSL line driver boosts office port density
Elantec Semiconductor has developed a very low power DSL line driver ideal for high-density central office (CO) applications.
News from Elantec Semiconductor, Jan 10, 2002
Mapper IC puts LANs and WANs on SONET networks
Agilent Technologies is claiming a breakthrough in networking for its HDMP-3001 Ethernet over SONET (EoS) mapper chip.
News from Agilent Technologies, Jan 9, 2002
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