Product category: Communications ICs (Wired)
News Release from: Texas Instruments (April 2001-March 2006)
Edited by the Electronicstalk Editorial Team on 21 February 2003
Nokia and TI extend development work
Nokia and Texas Instruments have extended their relationship through an agreement on Nokia's Series 60 Platform and Texas Instruments' industry-leading OMAP application processors
Nokia and Texas Instruments have extended their relationship through an agreement on Nokia's Series 60 Platform and TI's industry-leading OMAP application processors. As per the agreement, Texas Instruments intends to optimise the execution of the Series 60 platform on TI's OMAP processors and platform.
This article was originally published on Electronicstalk on 21 February 2003 at 8.00am (UK)
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Significant optimisation work has already been completed and the resulting prototype was demonstrated for the first time this week during the 3GSM World Congress in Cannes.
The demonstration features TI's Innovator development kit for the Series 60 Platform, which includes a colour screen, a keypad and all other components required by Series 60 based smart phones.
'Time-to-market is a critical component for any successful handset programme', said Niklas Savander, Senior Vice President, Nokia Mobile Software.
'The close collaboration with leading semiconductor companies, such as Texas Instruments, will enable Series 60 Platform licensees to bring phones to market faster.
Moreover by tapping into the capabilities of TI's OMAP platform, the end result will be smart phones with higher performance and advanced functionalities'.
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'Combining technologies from mobile industry leaders, Nokia and TI, will speed the introduction of 2.5G and 3G Smart Phones', said Alain Mutricy, TI Vice President, OMAP platform General Manager, wireless terminal Business Unit 'The high-performance and the low power consumption of the complete system solutions will also enable application developers to fully exploit the possibilities offered by 2.5 and 3G services'.
TI delivers the building blocks wireless manufacturers need to bring high-performance, power-efficient products to market - including complete wireless terminal chipsets and reference designs with protocol stacks and OMAP application processors.
The OMAP platform is comprised of high performance, power-efficient processors a robust software infrastructure and comprehensive support network for the rapid development of differentiated 2.5G and 3G multimedia-enhanced mobile devices and software applications.
TI's OMAP processors provide full compatibility with Series 60 Platform and symbian OS, allowing developers to create advanced applications in a proven environment.
The TI Innovator development kit for the Series 60 Platform enables application developers and handset manufacturers to simulate and validate their applications in a close-to-final mobile terminal environment.
The development kit is an ideal tool for building on and demonstrating high-performance applications and smart phones on a battery-operated handheld.
The Series 60 Platform is a software product for smart phones that Nokia licenses to other mobile-handset manufacturers.
Manufacturers will be able to integrate the Series 60 into their own phone designs running on top of Symbian OS.
The Series 60 Platform includes mobile browsing, multimedia messaging and content downloading, as well as a host of personal information management and telephony applications.
In addition, it includes a complete and modifiable user interface - all designed to run on top of Symbian OS, an operating system for advanced, data enabled mobile phones.
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