Communications ICs (Wired)
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Dual-UART bridge chip speeds throughput
The OXmPCI952 is a highly versatile bridge chip that integrates two high performance UARTs, a 3.3V PCI/mini-PCI interface and a parallel port/local bus in a 160 LQFP package.
News from GD Technik, Feb 10, 2004
Oxford signs for design-in expertise
Oxford Semiconductor has signed a franchise distribution agreement with design-in distributor GD Technik.
News from GD Technik, Feb 10, 2004
Report reveals top spot in traffic management
Market researcher In-Stat/MDR of Scottsdale, Arizona has ranked Agere number one worldwide in the sale of merchant traffic management (MTM) chips.
News from Agere Systems, Feb 6, 2004
Link doubles speed of legacy backplanes
A new advanced CMOS serial link enables 6Gbit/s transmission over legacy system backplanes that currently run up to 3Gbit/s.
News from Texas Instruments, Feb 5, 2004
Samsung expands towards the Edge
Agere Systems has signed its second multi-million-unit agreement with Samsung to supply wireless data chipsets and software for use in Samsung's new generation of advanced mobile phones.
News from Agere Systems, Feb 4, 2004
UART gains FIFO and real-time error detection
To support the ever-increasing speed and complexity in today's designs, the SC28L202 is the industry's first UART with a 256byte FIFO and real-time error detection.
News from Philips Semiconductors, Feb 4, 2004
Pair to pool LIN and CAN resources
ON Semiconductor and Melexis have formed an alliance to jointly market advanced devices and are working towards sharing intellectual property for independent product development by both companies.
News from ON Semiconductor, Feb 3, 2004
Agere continues revenue improvements
Agere Systems has reported revenues of $516 million for its first quarter of fiscal 2004, up 18% from revenues in the year-ago quarter, and up 2% sequentially.
News from Agere Systems, Jan 30, 2004
More functionality for LIN interface family
A new family of Local Interconnect Network ICs will allow Melexis customers to reach new levels of effectiveness in LIN system integration.
News from Melexis, Jan 30, 2004
Bridge speeds access to FireWire storage
Increased data transfer performance for small block sizes and disk striping capability feature in the latest FireWire (IEEE1394a) to IDE (ATA7) bridge IC from Oxford Semiconductor.
News from Oxford Semiconductor, Jan 30, 2004
Hitachi builds first microsystem with DAB
Hitachi is the first of the major Japanese brands to adopt the RadioScape DAB module concept, which has been used to bring the world's first microsystem with DAB, the AXM68D, to the UK market.
News from RadioScape, Jan 30, 2004
Alliance to form UWB special interest group
Texas Instruments is supporting the MultiBand OFDM Alliance's plans to formalise into a special interest group supporting growth of the emerging ultrawideband market.
News from Texas Instruments, Jan 30, 2004
Read-channel chip enables Flash-beating 1in HDD
Agere Systems is providing read-channel storage ICs to China-based manufacturer GS Magicstor for use in its 1in hard disk drive (HDD).
News from Agere Systems, Jan 28, 2004
Display interface standard cuts noise and power
The Mobile Pixel Link (MPL) physical layer is the first step in the standardisation process for a new serial interface for camera phones and small-form-factor displays.
News from National Semiconductor, Jan 27, 2004
Bridge chip brings HyperTransport to PCI-X
The high-performance AS90L10204 HyperTransport-to-PCI-X bridge is optimised for computing applications including workstations, computer servers, server blades, workstations and desktop PCs.
News from Alliance Semiconductor Corp, Jan 23, 2004
Shipment milestone signals approval of Chorus
Frontier Silicon has shipped over half a million units of its digital audio broadcast (DAB) chips worldwide, making the company's Chorus chip the clear market leader in DAB devices.
News from Frontier Silicon, Jan 23, 2004
Advanced Switching specification released
The Advanced Switching Interconnect Special Interest Group has released Version 1.0 of the Advanced Switching interconnect specification based on PCI Express interconnect technology.
News from Intel Corporation, Jan 21, 2004
Bridge chip adds new speed to VME bandwidth
Tundra Semiconductor has successfully demonstrated its 2eSST technology using the Tundra Tsi148 VME-to-PCI/Xbus bridge.
News from Tundra Semiconductor, Jan 21, 2004
FlexRay membership aids in-vehicle networking
In a move that will further strengthen the company's support for in-vehicle networking applications, AMI Semiconductor has signed up as an Associate Member of the FlexRay Consortium.
News from AMI Semiconductor, Jan 20, 2004
TDM devices claim new performance standards
Zarlink developed its 32K ZL50073 TDM switch family to meet the exacting requirements of high-bandwidth, wired and wireless networking equipment.
News from Zarlink Semiconductor, Jan 16, 2004
Transceiver upgrades legacy backplanes
A new high-speed quad serialiser/deserialiser (serdes) transceiver can extend the life of today's high-end router backplanes by quadrupling the data throughput capacity.
News from National Semiconductor, Jan 16, 2004
LIN transceiver powers up slave nodes
A novel LINbus transceiver IC with an onboard voltage regulator provides a 5V DC supply, allowing the development of simple, inexpensive slave nodes in a LINbus system.
News from Allegro MicroSystems Europe, Jan 15, 2004
Controllers simplify Serial ATA upgrade
The industry's first 3.0Gbit/s Serial ATA II PCI-X host controllers will enable the next generation of enterprise Serial ATA storage applications.
News from Marvell, Jan 13, 2004
SoC brings single-chip Serial ATA II to Fujitsu
The 88i6535 is the world's first SoC device that supports the Serial ATA II feature set and both 3.0 and 1.5Gbit/s operation for use in 2.5in hard disk drives.
News from Marvell, Jan 13, 2004
Collaboration to speed VoIP deployment
TI is working with Vonage to provide VoIP equipment manufacturers new opportunities for the development and deployment of VoIP products compatible with the Vonage telephony network.
News from Texas Instruments, Jan 13, 2004
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