Composite material for high-power cooling fins
A CPS Corp product story
Edited by the Electronicstalk editorial team Feb 9, 2007
AlSiC (Aluminum Silicon Carbide) from CPS Corporation is a metal matrix composite that enables cost-effective integration of cooling pin fins for high-power applications.
CPS Corporation has brought out a metal matrix composite called AlSiC (Aluminum Silicon Carbide) which enables the cost-effective integration of cooling pin fins for high power applications, such as traction, industrial drive and pulse power.
AlSiC's high stiffness to low density ratio is structurally suitable for larger parts with thin cross sections and enables the easy and effective incorporation of advanced thermal management features, such as pin fins.
Pins are cast during the AlSiC pressure infiltration process and are suitable for microprocessor lids or liquid cooled IGBT base plates.
By increasing the cooling surface area available for heat transfer, pin fins allow more efficient dissipation of heavy heat loads.
AlSiC's tailored, isotropic coefficient of thermal expansion (CTE) provides compatibility with electronic assemblies, devices and dielectric substrates to improve product reliability in the field.
AlSiC lids and baseplates prevent the bowing and flexing of packaging and substrate, eliminating failures due to delamination or cracking.
In addition, AlSiC exhibits a high thermal conductivity that provides high thermal dissipation.
AlSiC's novel casting process enables the cost-effective integration of pin fins and other advanced thermal management solutions, such as very high thermal conductivity inserts (>1000W/mK) or cooling tubes.
The CPS AlSiC near and net-shape fabrication process both produces the composite material and fabricates the product geometry, resulting in a cost-effective product.
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