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Composite material for high-power cooling fins
AlSiC (Aluminum Silicon Carbide) from CPS Corporation is a metal matrix composite that enables cost-effective integration of cooling pin fins for high-power applications.
News from Electronicstalk, 9 February 2007
Composite cools flip-chip packages
Metal matrix composite provides high-performance lids, or heat spreaders, for the flip-chip IC packaging and optoelectronic market.
News from Electronicstalk, 9 January 2007
Metal matrix composite is RoHS compliant
AlSiC metal matrix composite is ideally suited for thermal management solutions for high brightness LEDs.
News from Electronicstalk, 14 March 2006
MPU package lids build in thermal management
Aluminium silicon carbide metal matrix composite materials meet the material property, design and pricing demands for MPU assemblies that require integrated heatsink thermal management solutions.
News from Electronicstalk, 15 December 2005
Patented tubing promises active cooling solutions
CPS has recently been awarded a patent for tubing integrally enveloped within AlSiC thermal management composite materials for active cooling solutions.
News from Electronicstalk, 15 August 2005
Composite makes ideal housing for opto devices
AlSiC (aluminium silicon carbide) metal matrix composite is ideally suited for optoelectronic housings and lids.
News from Electronicstalk, 3 May 2005
Metal matrix makes IGBT baseplates
The AlSiC (aluminium silicon carbide) metal matrix composite from CPS Corp is ideally suited as a thermal management material for insulated gate bipolar transistor (IGBT) baseplates.
News from Electronicstalk, 3 May 2005
Composite is cool solution for high-power LEDs
Metal matrix composite is ideal for thermal management of high flux LED products, such as signal lamps, backlighting for signs, low profile luminaires, task lighting and display lighting.
News from Electronicstalk, 1 March 2005
Composite promises cost-effective military cooling
AlSiC (aluminium silicon carbide) metal matrix composite is ideal for applications in military electronics.
News from Electronicstalk, 1 March 2005
Substrates improve thermal management
AlSiC (aluminium silicon carbide) substrates from CPS Corp are ideal for power supply substrate applications, including carrier plates and heatsink materials for medical equipment power supplies.
News from Electronicstalk, 22 December 2004
Thermal inserts reduce cost and space requirements
AlSiC (aluminium silicon carbide) metal matrix composite is ideal for military and defence electronics.
News from Electronicstalk, 10 August 2004
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